WMSIC Electronic Components

DOWO DW-0805-100-12

ModelDW-0805-100-12
Package0805
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO DW-0805-100-12
Type
DOWO
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
DW-0805-100-12
Electronic Component
1
Package
0805
Electronic Component
Resettable Fuse
Electronic Component
0.028g
Electronic Component
1
Electronic Component
300ms
Electronic Component
BM0264801972
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
12V
Power(Pd)
600mW
Current(Imax)
100A
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DW-0805-100-12 产品概述

一、产品简介

DW-0805-100-12 是东沃(DOWO)推出的一款0805 封装表面贴装自恢复熔断器(PPTC)型号,标称工作电压 12V、保持电流 1A、动作电流 2A。器件针对便携、电源保护和信号线路短路/过流保护设计,体积小、响应稳定、可自动复位,适合 SMT 贴装工艺。

二、核心参数说明

  • 耐压 Vmax:12V(最大工作电压)
  • 最大电流 Imax:100A(短时脉冲/极限通过能力)
  • 保持电流 Ihold:1A(长期允许通过不触发动作的电流)
  • 跳闸电流 Itrip:2A(达到此电流典型触发过流保护)
  • 消耗功率 Pd:600mW(器件在规定条件下的最大耗散功率)
  • 初始态阻值 Rmin:60mΩ(常温、未动作时的最低电阻)
  • 跳断后阻值 R1max:250mΩ(动作后恢复时的最高阻值)
  • 动作时间:300ms(在规定过流条件下达到保护状态的参考时间)
  • 工作温度:-40℃ ~ +85℃
  • 封装:0805(符合常规 SMT 贴装尺寸)

三、主要特性与工作原理

该器件为聚合物正温度系数自恢复保险元件,常态下呈低阻抗,允许正常工作电流通过;当电路发生短路或过流时,器件在短时间内吸收能量并迅速升温,内阻显著增大以限制电流,从而保护下游电路。故障解除并冷却后,器件阻值恢复,恢复供电,无需更换。

四、典型应用场景

  • 1A 级别的便携式设备电源保护(移动电源、便携终端)
  • USB/数据线过流保护(5V 或 12V 受限场景)
  • 工业与消费电子的小电流电源轨保护
  • PCB 上对器件或模块的局部短路保护

五、选型与使用建议

  • 持续工作电流应低于 Ihold,推荐留有余量(例如不超过 0.8 × Ihold)以避免长期漂移或温升导致误动作。
  • Itrip 与系统故障电流需合理匹配,保证在故障时能迅速动作而不会在正常浪涌下误触发。
  • 受环境温度影响,Ihold 会随温度上升而下降,在高温工作场景需适当放大裕量。
  • 布局时避免将高热源紧邻器件;必要时为器件预留散热与测量点以验证温升。
  • 参考厂家的回流焊工艺规范进行焊接,避免超出推荐的峰值温度和时间。

六、封装与可靠性

0805 小尺寸适合高密度 PCB 设计,适配常见贴片工艺。工作温度范围 -40℃~+85℃ 能满足多数消费与工业环境。关于长期可靠性、循环动作寿命和回流焊限值建议参考东沃官方完整数据手册与可靠性测试报告,以获得更精确的工程设计参数。

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