WMSIC Electronic Components

DOWO BAT54S

ModelBAT54S
PackageSOT-23
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO BAT54S
Type
DOWO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
BAT54S
Electronic Component
1
Package
SOT-23
Electronic Component
Schottky Diode
Electronic Component
0.032g
Electronic Component
1
Electronic Component
BM0264866315
Current
200mA
Diode
1
Current(Ir)
2uA@25V
(Vf)
1V@100mA
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BAT54S(DOWO 东沃)产品概述

BAT54S 是一款常用的双二极管串联式肖特基(Schottky)整流器,DOWO(东沃)品牌,封装为 SOT-23,典型面向低电压、低功耗和快速开关场合。该器件标称“0.2A 30V”,结合实际电气参数,适合便携设备、小信号整流和保护电路等应用。

一 主要规格概览

  • 器件型号:BAT54S(双二极管,串联式)
  • 品牌:DOWO(东沃)
  • 封装:SOT-23(小型表贴)
  • 正向导通(Vf):1.0 V @ 100 mA(单对)
  • 直流反向耐压(Vr):30 V
  • 额定整流电流:200 mA(连续)
  • 反向漏电流(Ir):2 μA @ 25 V
  • 非重复峰值浪涌电流(Ifsm):600 mA

二 电气特性解读

  • 正向电压(Vf)1V@100mA:相较于典型肖特基而言此值偏高,表示在较大电流下Vf仍显著,应在设计时考虑功耗和压降,特别是电源或低压差场合。
  • 反向电压30V:能满足多数低压系统的反向阻断需求,适合5V、12V等常见轨电压保护与整流。
  • 漏电流2μA@25V:在中等温度下漏电控制较好,适用于低功耗电路,但注意高温下漏电会上升。
  • 连续整流200mA、浪涌600mA:适合小电流整流与保护,不能用于高功率整流场合;浪涌能力适合开机突发电流或短时浪涌。

三 封装与引脚说明

  • SOT-23 小型三脚封装,便于自动化贴装和高密度 PCB 布局。
  • 串联式结构:两只肖特基按串联方式集成,适用于需要串联耐压或级联整流的电路布局,可以节省器件数量与占板面积。

四 典型应用场景

  • 低压整流与反向保护(便携设备、充电器输入保护)
  • 信号钳位与快恢复保护(防止过冲、ESD 保护前级)
  • 半波/脉冲整流、低功率开关电源二次侧整流(小电流)
  • 逻辑电平隔离与方向导通控制

五 设计与使用建议

  • 尽量保持电流在额定200 mA以下连续工作,以避免过热和长期退化;在接近额定值时优化 PCB 铜箔面积以利散热。
  • 对于对压降敏感的设计,应评估 Vf 在预期工作电流下带来的效率损失,必要时选用低 Vf 的肖特基替代型号。
  • 注意环境温度对漏电流和正向压降的影响:高温会增加 Ir 并降低 Ifsm 能力,设计时应适当留有安全裕量。
  • 波峰电流为600 mA,但仅限短时脉冲,避免在高温或高频脉冲下长期依赖浪涌能力。

六 可靠性与注意事项

  • SOT-23 封装对焊接温度敏感,按常规贴片回流曲线控制峰值温度和时长,避免过热导致封装损伤。
  • 储存与焊接前注意防潮管控,吸湿回流可能引起封装翘起或焊接不良。
  • 长期工作于高反向电压与高温环境会加速漏电上升,应在可接受范围内进行寿命验证。

七 替代与选型建议

  • 若设计对正向压降要求更低,可选用同类低 Vf 肖特基(例如 BAT54 家族中的低 Vf 变体或其他厂商的低压降肖特基)。
  • 若需要更高电流能力,应选用封装更大、额定电流更高的整流二极管(SOD-123、SOD-128 或 DO-214 等)。

八 订购信息提示

  • 推荐料号填写示例:DOWO BAT54S SOT-23 0.2A/30V(确认包装形式:卷盘或托盘)。
  • 采购时注意核对批次与数据手册,确认 Vf、Ir 在目标温度和电流条件下的典型值是否满足设计要求。

总结:DOWO 的 BAT54S(SOT-23,串联式)以小型化和适度的整流能力为特点,适合低功耗、低电压和保护类应用。设计时关注正向压降与热管理,能在众多便携与工控小电流场合提供可靠表现。

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