WMSIC Electronic Components

DOWO BZT52C5V6

ModelBZT52C5V6
PackageSOD-123
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO BZT52C5V6
Type
DOWO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
BZT52C5V6
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.069g
Electronic Component
1
(Zzk)
400Ω
(Zzt)
40Ω
Electronic Component
BM0264356186
Diode
1
Current(Ir)
1uA@2V
Power Dissipation(Pd)
500mW
Electronic Component
5.32V~5.88V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C5V6(DOWO/东沃)产品概述

一、产品简介

BZT52C5V6 是东沃(DOWO)推出的一款小功率齐纳二极管,标称稳压值为 5.6V,采用 SOD-123 表面贴装封装。该器件以低击穿阻抗、高稳定性和良好的可靠性为主要特性,适用于空间受限的电源稳压、基准源及浪涌/钳位保护电路。

二、主要电气参数

  • 稳压值(标称):5.6V
  • 稳压值范围:5.32V ~ 5.88V
  • 反向电流 Ir:1 μA @ 2V
  • 最大耗散功率 Pd:500 mW(在规定散热条件下)
  • 击穿阻抗:Zzt = 40 Ω,Zzk = 400 Ω

三、关键特性

  • 低齐纳击穿阻抗:在工作电流下呈现较小的动态阻抗,有利于提高输出电压稳定度。
  • 低反向漏电:2V 时反向电流仅 1 μA,适合需要低泄漏电流的电路。
  • 小型封装与高功率密度:SOD-123 体积小,最大功率 500 mW,适合轻载稳压与保护应用。
  • 高可靠性:设计用于工业级稳压与瞬态抑制,长期稳定性良好。

四、封装与机械特性

SOD-123 为常见的小型表贴封装,适合自动贴片生产与高密度 PCB 布局。封装具有良好的焊接性与热传导性能,但器件整体功耗受 PCB 散热能力影响较大,板上铜箔面积和焊盘设计会显著影响实际可承受功率。

五、典型应用场景

  • 参考电压源、小功率线性稳压器的基准元件
  • 信号线/电源线的浪涌钳位与过压保护
  • 低功耗便携设备的电压监控与偏置电路
  • 各类电子模块内的小信号稳压与保护用途

六、使用建议与注意事项

  • 功耗降额:500 mW 为最大耗散功率,在实际电路中应考虑环境温度与 PCB 散热,推荐留有安全余量并参考厂方数据手册的功率-温度降额曲线。
  • 串联电阻:用于稳压应用时建议串联限流电阻以控制齐纳电流,保证稳压在允许功耗范围内。
  • 焊接工艺:遵循 SOD-123 的回流焊工艺规范,避免过热或反复加热导致封装应力。
  • 仪表测量:测量稳压特性时应使用合适的电流源和低噪声测量,避免静态电流对稳压精度的影响。

七、结论

BZT52C5V6(DOWO)是一款适用于小功率稳压与保护的齐纳二极管,具有低击穿阻抗、低漏电和良好可靠性。其 SOD-123 小型封装适合空间受限的表贴电路,但实际功耗与稳定性依赖于电路设计与 PCB 散热处理。建议在设计初期参考完整数据手册并进行功率与热仿真验证,以确保长期可靠运行。

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