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DOWO BAV99
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DOWO BAV99
- Type
- DOWO
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- DOWO
- Electronic Component
- BAV99
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Switch Diode
- Electronic Component
- 0.032g
- Electronic Component
- 1
- Electronic Component
- BM0264548693
- Current
- 200mA
- Diode
- 1
- Current(Ir)
- 2.5uA@70V
- (Vf)
- 1.25V@150mA
- Power Dissipation(Pd)
- 225mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAV99 产品概述
一、概述
BAV99 是一款常用于高速开关和小信号整流的双二极管器件，东沃（DOWO）提供的该型号为“1对串联式”封装，采用 SOT-23 小外形，适合表面贴装应用。器件针对高耐压与快速恢复场合优化，兼顾较低正向压降与较小反向漏电，适合便携式和高密度电路板设计。
二、主要参数
- 二极管配置：1对串联式
- 封装：SOT-23（表面贴装）
- 耗散功率 (Pd)：225 mW
- 正向平均整流电流 (If)：200 mA
- 正向压降 (Vf)：1.25 V @ 150 mA
- 直流反向耐压 (Vr)：70 V
- 非重复峰值浪涌电流 (Ifsm)：2 A
- 反向电流 (Ir)：2.5 μA @ 70 V
- 反向恢复时间 (Trr)：6 ns
- 品牌：DOWO（东沃）
三、电气特性与性能分析
BAV99 在 70 V 的反向耐压下保持微安级的漏电流，适合中高压小信号场合；正向压降 1.25 V（150 mA）在同类开关二极管中处于合理范围，能够在 200 mA 的工作电流下提供稳定的整流与开关性能。6 ns 的反向恢复时间表明器件适用于高频开关与快速脉冲应用，峰值浪涌能力 2 A 能承受短时冲击但需注意热量积累与封装耗散限制（Pd 225 mW）。
四、封装与机械特性
SOT-23 小尺寸封装便于高密度贴片布局，适配自动贴装与回流焊流程。封装内为两只串联二极管的集成结构，便于在电路中实现串联整流、钳位或电平转移功能。设计 PCB 时应考虑热阻与散热路径，尽量增大焊盘铜面积以提升耗散能力。
五、典型应用场景
- 高频开关与脉冲整形电路
- 小信号整流与钳位（保护输入、限幅）
- 逻辑电平转换与混合信号隔离
- 射频前端的保护与检测电路（非高功率放大段）
- 便携设备、通信设备和工业控制中的通用二极管需求
六、选型与使用注意事项
- 工作电流尽量维持在额定 200 mA 以下，长期高流会受限于封装 Pd。
- 对于频繁大幅度冲击电流，应评估 Ifsm（2 A）能否满足并预留热裕量。
- 高频应用关注 Trr（6 ns）及寄生电容，板级布局要最小化回流环路。
- 在高压反向工况下注意 Ir 随温度上升而增加，必要时加热管理或选用低漏电替代器件。
- 焊接工艺遵循 SOT-23 回流温度曲线，避免长期过热引起参数漂移。
七、总结
DOWO 的 BAV99（SOT-23，1对串联式）在 70 V 耐压、200 mA 工作电流与 6 ns 快速恢复时间之间取得了良好平衡，适合高频开关、小信号整流与钳位保护等多种场合。合理的 PCB 热管理与电流/峰值冲击控制能确保器件长期可靠运行。
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