WMSIC Electronic Components

DOWO MMBT3904

ModelMMBT3904
PackageSOT-23
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO MMBT3904
Type
DOWO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
MMBT3904
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.032g
Electronic Component
1
Electronic Component
BM0264866314
Transistor Type
NPN
Frequency(f T)
300MHz
Power Dissipation(Pd)
200mW
Electronic Component
Electronic Component
Electronic Component
3000
Collector Current(Ic)
200mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMBT3904产品概述

一、产品简介

MMBT3904(DOWO/东沃品牌,封装:SOT-23)是一款通用小信号NPN晶体管,单只件(数量:1)。器件具有工作电流高达200mA、集—射击穿电压Vceo为40V,适用于放大与开关场合。体积小、频率响应好、成本低,是常见的电子设计替代与通用选择。

二、主要性能参数

  • 晶体管类型:NPN
  • 最大集电极电流 Ic:200mA
  • 集—射击穿电压 Vceo:40V
  • 耗散功率 Pd(封装SOT-23):200mW(环境依赖)
  • 直流电流增益 hFE:典型300(工作点相关)
  • 特征频率 fT:约300MHz
  • 集电极截止电流 Icbo:约100nA(典型)
  • 集—射极饱和电压 VCE(sat):约300mV(典型)
  • 射—基击穿电压 Vebo:6V

以上参数为典型/最大值,设计时请参考厂家数据表以获得详细测试条件。

三、引脚与封装说明

封装:SOT-23(小型3引脚)。常见引脚分配(请以具体器件数据表为准):

  • 引脚1:B(基极)
  • 引脚2:C(集电极)
  • 引脚3:E(发射极)
    SOT-23体积小,利于表面贴装(SMT)生产,适合空间受限的电路板设计。

四、典型应用

  • 小信号放大器(音频前级、射频前端低功率放大)
  • 通用开关(逻辑电平驱动、继电器/小电机驱动的前级)
  • 电平转换与缓冲器
  • 恒流源、温度传感与简单振荡器电路

得益于fT≈300MHz,适合低中频率段的放大与开关应用。

五、使用建议与注意事项

  • 由于Pd仅200mW,长期大电流工作需注意功耗与结温,尽量降低Vce上的功耗(采用饱和开关或外加散热铜箔)。
  • hFE为典型值,随Ic和温度变化大;在精确偏置电路中需留裕量或选用反馈稳定电路。
  • VCE(sat)约300mV,作为低压差开关时应根据驱动电流与饱和条件评估功耗与电压降。
  • 漏电流(Icbo)随温度上升增加,温度敏感应用需考虑偏置点漂移。
  • 引脚排列与封装标识在不同厂家细节可能不同,生产前务必核对东沃数据手册与PCB封装库。

六、热管理与可靠性

在SOT-23封装下,热阻较大,建议:

  • 在PCB设计中增加顶层/底层铜箔作为散热路径;
  • 对于连续接近最大Ic的工作,采取降低占空比或外加散热处理;
  • 在高温环境中进行热降额设计,保证结温不超过允许范围以延长寿命。

七、采购与替代

DOWO(东沃) MMBT3904( SOT-23)适合大批量SMT装配。若需要更高功耗或不同封装,可选TO-92或功率更高的替代型号。购买时注意批次与管脚排列,索取并参照东沃官方数据手册以确保参数与封装一致。

如需示例电路图、PCB封装建议或基于该型号的偏置计算,可提供工作电压与负载条件,我将给出更详细的设计指导。

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