WMSIC Electronic Components

DOWO BZT52C36S

ModelBZT52C36S
PackageSOD-323
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO BZT52C36S
Type
DOWO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
BZT52C36S
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
0.028g
Electronic Component
1
(Zzk)
350Ω
(Zzt)
90Ω
Electronic Component
BM0264342813
Diode
1
Current(Ir)
100nA
Power Dissipation(Pd)
200mW
Electronic Component
34V~38V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C36S 产品概述

一、产品简介

BZT52C36S 是 DOWO(东沃)推出的一款独立式贴片稳压二极管,采用 SOD‑323 小型封装,标称稳压值 36V,适用于中高压小功率稳压与浪涌钳位场合。器件具有低齐纳击穿阻抗、良好的稳压性能和可靠性,适合体积受限的便携与消费电子产品。

二、主要电气参数

  • 稳压值(标称):36V
  • 稳压值范围:34V ~ 38V
  • 最大耗散功率 Pd:200mW
  • 反向电流 Ir:100nA(典型测试条件下)
  • 齐纳击穿阻抗 Zzt:90Ω
  • 峰值击穿阻抗 Zzk:350Ω
  • 配置:1个独立式二极管
  • 封装:SOD‑323(贴片)

计算参考:在最大耗散功率下的最大稳压电流 Iz ≈ Pd / Vz = 200mW / 36V ≈ 5.6mA。实际电路中应根据稳压精度和散热条件选择合适的工作电流,一般在数毫安量级。

三、性能与特点

  • 低齐纳击穿阻抗,有利于在工作电流变化时维持较好的电压稳定性。
  • 最大耗散功率 200mW,适合低功耗稳压、小信号钳位与基准应用。
  • 反向漏电小(Ir≈100nA),有助于在高阻抗电路中降低漏电引起的误差。
  • 小型 SOD‑323 封装,便于表面贴装和高密度电路布局。
  • 高稳定性、高可靠性,适合长期使用的工业与消费电子产品。

四、典型应用场景

  • 小功率电源的基准稳压或过压保护。
  • 信号线或模拟前端的浪涌钳位与保护电路。
  • 精密仪表和传感器接口的电压参考(配合合适电流源)。
  • 便携设备、通信模块、消费电子中对体积和可靠性有要求的场合。

五、PCB 与热设计建议

  • 虽为小功率器件,但仍需注意封装散热:尽量采用较宽的焊盘和适量铜箔面积以利导热。
  • 布线尽量短且粗,避免长细走线带来额外热阻和寄生阻抗。
  • 工作在接近最大耗散功率时,应进行降额设计并考虑环境温度对耗散能力的影响。
  • 对于噪声敏感电路,稳压二极管与被保护节点尽量靠近布置,以减少引线和寄生电容的影响。

六、选型与使用注意事项

  • 根据电路所需稳压精度选择工作电流,避免长期在 Pd 附近连续工作。
  • 在高温环境或多器件密集布置时,按热降额曲线降低允许功耗。
  • 若需更低稳压阻抗或更高功率,应考虑更大封装或更高功率等级的齐纳管。
  • 采购时确认包装形式(卷带/盘)以匹配贴片生产工艺。

七、封装与可得性

BZT52C36S 由 DOWO(东沃)提供,SOD‑323 表面贴装封装,适用于自动贴装生产线。常见供货形式为卷带包装,具体交期与最小包装量请向供应商或代理商确认。

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