WMSIC Electronic Components

DOWO SMDJ33CA

ModelSMDJ33CA
PackageSMC(DO-214AB)
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO SMDJ33CA
Type
DOWO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
SMDJ33CA
Electronic Component
1
Package
SMC(DO-214AB)
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.042g
Electronic Component
1
Electronic Component
BM0230826975
Voltage
53.3V
Current(Ir)
2uA
Voltage(VBR)
36.7V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMDJ33CA 瞬态电压抑制二极管(SMC 双向)产品概述

一、产品简介

SMDJ33CA 是 DOWO(东沃)推出的一款双向瞬态抑制二极管(TVS),封装为 SMC(DO-214AB),专为抑制电源和信号线上的瞬态过电压而设计。器件对两极性浪涌均具有快速钳位能力,适用于直流或交流系统的浪涌保护。

二、关键参数

  • 极性:双向(Bidirectional)
  • 额定反向截止电压 Vrwm:33 V
  • 钳位电压 Vc(典型):53.3 V(在规定冲击条件下测得)
  • 峰值脉冲电流 Ipp:56.29 A
  • 峰值脉冲功率 Ppp:3 kW @ 10/1000 μs 浪涌波形
  • 击穿电压 Vbr:36.7 V
  • 反向漏电流 Ir:2 μA
  • 类型:TVS(瞬态电压抑制)
  • 封装:SMC (DO-214AB)
    以上参数适用于典型应用条件,选型时请参考厂方完整数据手册以获得温度和测试条件下的准确信息。

三、主要特性与优点

  • 高能量吸收能力:3 kW(10/1000 μs)浪涌抑制,能应对瞬态大功率冲击。
  • 低钳位电压:在大电流冲击时仍能将电压钳制在约 53.3 V,保护下游器件免受高压损坏。
  • 低漏电流:典型反向漏电仅 2 μA,有助于低功耗系统保持能效。
  • 双向结构:无需区分极性,适合交流线路或双向脉冲干扰场合。
  • SMC 封装:体积适中,便于表面贴装生产和散热。

四、典型应用场景

  • 电源系统输入端(DC-DC、直流母线保护)
  • 通信设备、信号线路防护(串口、总线)
  • 工业控制与仪器仪表的浪涌保护
  • 汽车电子辅助保护(需确认符合汽车等级规范)
  • 变频器、逆变器输入侧的瞬态抑制

五、选型与使用建议

  • 确认系统工作电压:Vrwm(33 V)应高于正常工作电压且有一定裕量。
  • 考虑浪涌能量分配:若系统可能遭受多次浪涌,需评估器件累积热应力与散热条件。
  • PCB 布局:将 TVS 放置于被保护节点尽可能靠近入点并采用大面积铜箔散热,缩短与受保护器件的回路长度以降低寄生感抗。
  • 回流焊兼容性:SMC 为常见 SMT 封装,请依据回流曲线执行焊接工艺,避免超温损伤器件。
  • 环境与可靠性:在高温或高湿环境下,应参考数据手册中的温度系数与寿命评估,必要时考虑冗余保护设计。

六、封装与可靠性

SMC(DO-214AB)封装具备较好的热性能和机械强度,适合自动贴装和回流焊工艺。为保证长期可靠性,建议在器件两侧和底部保留适当焊盘面积以增强散热,焊接后进行必要的耐压与浪涌验证。购买时选择有质量认证和追溯渠道的供应商,确保为正品 DOWO(东沃)器件。

如需具体功率-电流曲线、瞬态响应波形或封装尺寸图,请提供邮箱或进一步要求,以便提供完整数据手册与应用参考电路。

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