WMSIC Electronic Components

DOWO ES1D(SOD-123FL) ES1D

ModelES1D(SOD-123FL)
PackageSOD-123FL
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO ES1D(SOD-123FL)
Type
DOWO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
ES1D(SOD-123FL)
Electronic Component
1
Package
SOD-123FL
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.042g
Electronic Component
1
Electronic Component
BM0258760036
Current
1A
Diode
1
Current(Ir)
5uA
(Vf)
1.3V@1A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ES1D (SOD-123FL) 产品概述

一、产品简介

ES1D 系列是一款通用整流/快速恢复二极管,东沃(DOWO)以 SOD-123FL 小封装提供该型号,适用于体积受限且需一定开关速度的电源及保护电路。器件为单只独立式二极管,结构紧凑,便于表面贴装和自动化生产。

二、主要电气参数

  • 正向压降 (Vf):1.3V @ 1A(典型值)
  • 直流反向耐压 (Vr):200V
  • 反向电流 (Ir):5µA(典型,常温)
  • 反向恢复时间 (Trr):35ns
  • 工作结温范围:-55℃ ~ +150℃

以上参数指示该器件在 1A 级别工作条件下具有较低的正向压降、较小的反向漏流及快速的恢复特性。

三、产品特性与优势

  • 小型 SOD-123FL 封装,适合高密度 PCB 布局;
  • Vf 较低,有利于降低整流损耗和功率耗散;
  • Trr 为 35ns,适合中等频率开关场合,能减少开关损耗与电磁干扰;
  • 低漏电流利于高阻态下的稳定性与待机功耗控制;
  • 宽工作结温范围,可靠性高,适应恶劣环境。

四、典型应用场景

  • 开关电源与DC-DC转换器的整流或续流二极管;
  • 适配器、充电器及家用电器的整流与保护电路;
  • 电机驱动、逆变器中的回扫或自由轮二极管;
  • 一般工业电子设备与消费类电子的小功率整流与钳位。

五、封装与热管理

SOD-123FL 为薄型表贴封装,热阻相对较小,但在持续 1A 级工作时仍需注意 PCB 散热设计:增大导热铜箔面积、使用过孔连接散热层或将器件靠近接地/散热平面,都有助于降低结温并提高可靠性。

六、使用建议与注意事项

  • 推荐按典型电流 1A 级使用,并在电源设计中预留适当余量与热降额;
  • 在高反向电压应用中注意漏电随着温度升高而上升,应作温度校正;
  • 焊接采用常见回流工艺,遵循封装材料和厂商给出的温度曲线;
  • 如需用于高频 (>几百 kHz) 或高浪涌电流场合,请做实际测试验证以确保性能满足需求。

如需更详细的特性曲线、封装尺寸或可靠性数据,建议索取东沃官方数据手册以便做进一步设计验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.