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DOWO DSK36
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DOWO DSK36
- Type
- DOWO
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- DOWO
- Electronic Component
- DSK36
- Electronic Component
- 1
- Package
- SOD-123FL
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.042g
- Electronic Component
- 1
- Electronic Component
- BM0264801970
- Current
- 3A
- Diode
- 1
- Current(Ir)
- 100uA@60V
- (Vf)
- 700mV@3A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DSK36 — 3A 60V 低压降整流二极管产品概述
一、产品简介
DSK36 是东沃（DOWO）出品的一款高速整流二极管，单只独立封装，采用 SOD-123FL 小型表贴封装。器件额定整流电流为 3A，直流反向耐压为 60V，设计用于中低压电源整流、续流保护与一般功率整流场合，兼顾体积小、热性能合理与焊接可靠性。
二、主要电气特性
- 正向压降（Vf）：0.7V（在 If = 3A 条件下典型值）——低压降有利于降低整流损耗和发热。
- 额定整流电流：3A（连续直流）——适合中等功率线路应用。
- 直流反向耐压（Vr）：60V——适用于多数 12V/24V 系统及部分中间总线电路。
- 反向漏电流（Ir）：100μA（Vr = 60V）——保证在高压偏置下漏电可控。
- 非重复峰值浪涌电流（Ifsm）：65A——短时冲击能力强，能承受开机、短路或浪涌电流冲击。
- 工作结温范围：-55℃ ~ +150℃——宽温区适应工业级环境。
三、封装与热管理
DSK36 采用 SOD-123FL 小型扁平表贴封装，适合自动化贴片与回流焊工艺。尽管器件体积小，但在高电流工作时仍需注意PCB散热设计：
- 在封装下方及引脚处铺设热铜箔和过孔，增加散热能力；
- 保持足够的铜面积和散热路径以降低结温；
- 推荐遵循东沃提供的回流焊温度曲线（按 IPC/JEDEC 标准）以确保焊接可靠性。
四、典型应用场景
- 开关电源整流输出、一级整流；
- 链接电源模块的续流/钳位二极管；
- 充电器与适配器、车载电源保护电路；
- 电机驱动的反向电压保护与吸收；
- 一般电子产品中的整流与防反接电路。
五、使用注意事项
- 在选择器件时应综合考虑平均功耗：例如在 3A 连续工作、Vf≈0.7V 条件下，整流损耗约为 2.1W，需保证 PCB 有足够散热能力以使结温维持在安全范围内；
- 对于频繁脉冲或高速开关环境，若对恢复时间或反向恢复电流有严格要求，请参照厂家完整数据表确认动态参数；
- 在高温或高应力环境下，建议预留安全裕度，避免长期在最高结温下工作以提高可靠性。
六、可靠性与质量保证
东沃（DOWO）作为品牌供应商，DSK36 在制造过程中执行严格的质量控制与出厂测试，包括电气参数筛选、热循环与焊接兼容性测试。用户在采购时建议向供应商索取完整数据手册与可靠性报告，以便用于认证或设计验证。
七、结语
DSK36（3A/60V，SOD-123FL）以其低正向压降、良好浪涌承受能力和宽温度范围，适合多种中功率整流与保护应用。合理的 PCB 热设计与按规格的焊接工艺可充分发挥其性能，提升系统可靠性。若需更详细的电气特性曲线、封装尺寸或回流曲线，请联系东沃或参考其官方数据手册。
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