WMSIC Electronic Components

DOWO MMSZ5240B

ModelMMSZ5240B
PackageSOD-123
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO MMSZ5240B
Type
DOWO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
MMSZ5240B
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.033g
Electronic Component
1
(Zzk)
600Ω
(Zzt)
17Ω
Electronic Component
BM0264801967
Diode
1
Current(Ir)
3uA@8V
Power Dissipation(Pd)
500mW
Electronic Component
9.5V~10.5V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMSZ5240B 产品概述

一. 概要

MMSZ5240B 是一款由 DOWO(东沃)提供的独立式小功率齐纳二极管,采用 SOD-123 封装,针对需要稳定参考电压或过压钳位的贴片场合设计。器件标称稳压值为 10V(允许范围 9.5V ~ 10.5V),具有低齐纳阻抗和良好的长期稳定性,适用于空间受限且需中低功率耗散的电路中作为基准或保护元件。

二. 电气特性与典型参数

  • 类型:独立式齐纳二极管(单只)
  • 稳压值(标称):10V
  • 稳压范围:9.5V ~ 10.5V
  • 反向电流 Ir:3 μA @ 8V(反向偏置下的泄漏电流)
  • 耗散功率 Pd:500 mW(器件最大耗散,实际应用需降额处理)
  • 齐纳阻抗 Zzt:17 Ω(在规定测试条件下的动态阻抗,反映稳压能力)
  • 拐点阻抗 Zzk:600 Ω(低电流或拐点区的阻抗特性)
  • 封装:SOD-123(小型贴片封装)
  • 品牌:DOWO(东沃)

三. 主要特点与优势

  • 低齐纳阻抗:Zzt 值较小,能在一定范围内提供更稳定的参考电压,减少电压随电流变化的漂移。
  • 中等功率耗散:500 mW 的耗散能力适合小功率稳压或短时钳位应用。
  • 高可靠性与稳定性:适合长期工作环境,温漂和老化特性优异(需参照厂家完整数据表验证)。
  • 小型表面贴装:SOD-123 便于自动贴装与高密度 PCB 布局。

四. 典型应用

  • 电源参考与基准电压源(配合限流电阻形成简单的并联稳压电路)
  • 测试与测量电路中的固定电压基准
  • 过压保护与钳位(吸收瞬态过压脉冲,保护后级电路)
  • 电平移位与信号夹位
  • 小型电池供电或便携设备中对体积和成本敏感的稳压场合

五. 封装与安装注意

  • SOD-123 为小尺寸贴片封装,焊接时需注意回流曲线与焊盘设计,确保良好热路径以利散热。
  • 极性识别:注意器件标识带(阴极带),安装时避免反向装配。
  • PCB 布局建议在器件下方或附近提供适量铜箔以增加散热能力,并考虑将负载或限流电阻靠近齐纳二极管布置以减小寄生阻抗。

六. 热与可靠性考量

  • 虽然标称 Pd = 500 mW,但在实际长期运行中建议降额使用(例如 50%~80%),并依据环境温度做功耗热降额曲线计算。
  • 大电流或持续高耗散条件下需避免单器件持续工作在额定极限,以免导致温度升高、性能漂移或寿命缩短。
  • 在高温环境或散热受限的板上,可以通过增大铜箔、加散热片或并联多只器件来改善热管理。

七. 选型建议与注意事项

  • 若电路对稳压精度要求较高,应结合稳压电流范围和实际工作电流选择合适型号,并参考完整数据手册中的电流—电压曲线与温度系数。
  • 注意 Ir 测试点(3 μA @ 8V)代表低电流下的泄漏特性,实际应用中若工作电流接近 μA 级,输出电压可能受泄漏影响。
  • 对瞬态抑制或大功率钳位需求,应考虑替代的大功率齐纳或瞬态抑制二极管(TVS),以保证可靠性。

如需器件详细封装尺寸、完整电学曲线或样片/订购信息,可提供更具体的需求,我可以帮您进一步核对数据表或给出 PCB 布局与热设计建议。

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