Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
DOWO BAV70 A4 BAV70
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DOWO BAV70 A4
- Type
- DOWO
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- DOWO
- Electronic Component
- BAV70 A4
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Switch Diode
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0258760023
- Current
- 200mA
- Diode
- 1
- Current(Ir)
- 2.5uA@70V
- (Vf)
- 1.25V@150mA
- Power Dissipation(Pd)
- 225mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAV70 A4 产品概述
一、主要参数
BAV70 A4（DOWO/东沃）是一款 SOT-23 封装的双二极管，1对共阴极配置。关键电气参数包括：正向压降 Vf = 1.25 V @ 150 mA，直流反向耐压 Vr = 70 V，整流电流（平均）If = 200 mA，耗散功率 Pd = 225 mW，反向电流 Ir = 2.5 μA @ 70 V，反向恢复时间 Trr = 6 ns，非重复峰值浪涌电流 Ifsm = 2 A。该器件适用于小信号快速开关与整流场合。
二、主要特点
- 低正向压降与中等电流能力：Vf 约 1.25 V（150 mA），适合对压降敏感的小功率路径。
- 快速恢复：Trr = 6 ns，适合高速开关与脉冲信号应用，能够在较高频率下保持良好响应。
- 高反向耐压：70 V 的耐压值使其能在较高电压的信号或防护电路中使用。
- 小封装、低泄漏：SOT-23 小型封装、Ir 仅 2.5 μA（@70 V），便于高密度布局与低漏电要求电路。
三、封装与引脚
SOT-23 封装，三引脚布局实现一对共阴极（二个阳极共用一阴极）。适合表面贴装生产（SMT），占板面积小，良好的自动贴装兼容性。实际设计中建议为散热在 PCB 上预留铜箔扩展区以提高功耗承受能力。
四、典型应用场景
- 高速开关与逻辑电平转换、脉冲整形。
- 射频/混频电路中的信号整流或保护（小信号）。
- 输入保护与浪涌钳位（结合限流或吸收元件）。
- 采样保持、检测电路与小电流整流场合。
五、设计与使用建议
- 功耗与散热：在 150 mA 工作点，器件功耗约 I·V = 0.15 A × 1.25 V ≈ 187.5 mW，接近 Pd=225 mW，建议考虑降额使用并增加 PCB 散热铜箔以避免热累积。
- 浪涌与可靠性：Ifsm = 2 A 为非重复峰值，允许短时浪涌但不作为连续载流使用。
- 反向耐压裕量：设计时保持 Vr 70 V 以上裕量，避免长期在高 Vr 下导致泄漏升高或击穿风险。
- 布局：将二极管接近受保护或开关器件放置，减小寄生电感与提升响应速度。
六、典型电路示例
- 共阴极配置适用于双路信号同时进行反向隔离或两个输入的共地保护；在整流或检波电路中可做双路整流/检波使用。结合阻容元件可构成钳位、限幅或采样网络。
七、采购与替代
DOWO（东沃）品牌提供此型号的量产和封装选择。若需替代，可查找参数相近的双二极管（共阴极、SOT-23、Vr≈50–100 V、Trr≈几 ns、If≈100–300 mA）进行性能比对与验证。
总结：BAV70 A4 在小尺寸、低漏电、快速恢复与中等耐压之间取得平衡，适合高密度、快速开关与小信号整流类应用，但在接近额定功耗时需注意散热与降额设计。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
