WMSIC Electronic Components

DOWO AO3401PSA

ModelAO3401PSA
PackageSOT-23
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO AO3401PSA
Type
DOWO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
AO3401PSA
Electronic Component
1
Package
SOT-23
Electronic Component
1 P
Electronic Component
MOSFET
Electronic Component
0.032g
Electronic Component
1
Electronic Component
BM0264801995
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
1.2W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
30V
Capacitor(Ciss)
780pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AO3401PSA 产品概述

一、概述

AO3401PSA 是东沃(DOWO)推出的一款高性能 P 沟道 MOSFET,SOT-23 小封装设计,适用于中低电压电源开关和高频硬开关场合。器件在保证小封装的同时,通过高密度单元工艺实现极低导通电阻,兼顾开关速度与散热性能,适合消费类和工业类电源管理应用。

二、主要规格

  • 极性:P 沟道 MOSFET
  • 漏源最大电压 Vdss:-30 V
  • 连续漏极电流 Id:-4.1 A(负向表示 P 沟道)
  • 导通电阻 RDS(on):< 65 mΩ(VGS = -10 V)
  • 最大耗散功率 Pd:1.2 W
  • 阈值电压 VGS(th):≈ -0.7 V(典型)
  • 输入电容 Ciss:780 pF;反向传输电容 Crss:65 pF
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:SOT-23

三、产品特性

  • 优秀的小封装热性能:SOT-23 封装经过优化,利于 PCB 散热与密集布局。
  • 超低导通电阻:在 VGS = -10 V 时 RDS(on) < 65 mΩ,可减小导通损耗。
  • 适应高速开关:中等输入/反向传输电容(Ciss/Crss)兼顾驱动能耗与开关损失,适合硬开关与高频应用。
  • 宽温度范围:-55 ℃ 至 +150 ℃,适合恶劣环境下长期可靠工作。

四、典型应用

  • 高侧电源开关与负载断开(便于用 P 沟道实现高侧开关)
  • 电池管理与电源路径选择、反向连接保护
  • DC-DC 转换器中的开关管或同步整流(适用于较低功率等级)
  • 工业与消费电子中的硬开关、高频开关电路

五、使用建议

  • 栅极驱动:P 沟道在高侧应用时,栅源电压需相对于源极施加负向驱动,注意栅压不要超过器件最大额定值。VGS(th) 约 -0.7 V,实际驱动电压建议充分超过阈值以保证低 RDS(on)。
  • 功耗与散热:SOT-23 封装的 Pd 为 1.2 W(器件自身限制与 PCB 散热密切相关),高电流工作时需通过铜箔面积和散热布局降低结温,避免长期热应力。
  • 布局注意:尽量将散热铜箔连接到漏极/源极并缩短走线,减少寄生电感以利开关性能。
  • ESD 与焊接:按常规 MOSFET 操作防静电,再流焊温度与湿敏级别按照供应商数据手册处理。

六、封装与热管理

SOT-23 封装便于表面贴装和空间受限场合,但热阻相对较大。推荐在 PCB 下侧或周围增加铜层并与多层地/电源层热连接,以提升功耗能力和可靠性。

七、选型要点

在选型时结合系统最大工作电压、连续/脉冲电流、允许的结温及开关频率综合考量。若需更低导通损耗或更高电流能力,可考虑更大封装或 RDS(on) 更低的替代型号。

总结:AO3401PSA 在-30 V、-4.1 A 级别的小功率高侧开关应用中提供了良好的导通性能与封装效率,是需要在 SOT-23 封装下实现低损耗高密度布局的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.