WMSIC Electronic Components

DOWO MMBT5401

ModelMMBT5401
PackageSOT-23
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO MMBT5401
Type
DOWO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
MMBT5401
Electronic Component
1
Package
SOT-23
Electronic Component
1 PNP
Electronic Component
Transistor(BJT)
Electronic Component
0.033g
Electronic Component
1
Electronic Component
BM0257247598
Transistor Type
PNP
Frequency(f T)
100MHz
Power Dissipation(Pd)
300mW
Electronic Component
Electronic Component
Electronic Component
3000
Collector Current(Ic)
600mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMBT5401(DOWO/东沃)产品概述

一、产品简介

MMBT5401 为PNP型小功率高压晶体管,采用SOT-23封装,适用于空间受限的表面贴装电路。器件具有较高的集电极击穿电压与适中的工作频率,兼顾高压耐受与开关/放大应用,常作为高压侧开关、反相放大与电平移位电路的选择元件。

二、主要参数

  • 晶体管类型:PNP
  • 最大集电极电流 Ic:600 mA(使用时应考虑封装及热限制)
  • 集电极—发射极击穿电压 Vceo:150 V
  • 耗散功率 Pd:300 mW(SOT-23封装)
  • 特征频率 fT:100 MHz(适合低功率高频应用)
  • 集电极截止电流 Icbo:100 nA(典型低漏电)
  • 集射极饱和电压 VCE(sat):约 0.5 V(在 Ic=50 mA、5 mA 条件下测得)
  • 发射极—基极反向击穿 Vebo:5 V
  • 品牌:DOWO(东沃)
  • 封装:SOT-23

三、性能特点

  1. 高压能力:Vceo 达 150 V,可在较高电压场合作高侧开关或电平移位器件。
  2. 低功耗封装:SOT-23 与 300 mW 耗散功率适合小信号与中小电流场合,但不宜长时间大电流工作。
  3. 较高频率响应:fT ≈ 100 MHz,能满足一般射频前端的低功率放大或高速开关需求。
  4. 低漏电流:Icbo ≈ 100 nA,有利于提高静态性能与降低偏置损耗。
  5. 饱和电压适中:VCE(sat) ≈ 0.5 V,在开关应用中需考虑功耗与电压降。

四、典型应用场景

  • 高压侧开关与反向控制电路(如电池管理、反极性保护)。
  • 小功率放大器与电平移位器,适用于音频级与逻辑接口电路。
  • 高频脉冲开关、驱动小继电器或LED(受限于封装热量与VCE(sat))。
  • 通用电路中作为电流镜、偏置网络的PNP元件。

五、使用建议与注意事项

  • 热管理:Pd 仅 300 mW,若长期大电流(接近 Ic 规格)会导致过热,应在PCB上增加散热铜箔或热 vias,或减小占空比。
  • 饱和驱动:为确保饱和导通,建议在开关应用中采用较低的强迫β(如 10–20),据此计算基极限流电阻。
  • 反向基极电压限制:Vebo = 5 V,避免在电路中对基极施加过高反向电压以防损坏。
  • 漏电考量:Icbo 虽小,但在高温下可能增大,需在高温环境验证静态性能。
  • 封装限制:SOT-23 的引脚间距和散热能力有限,设计时需兼顾布线与焊接工艺。

六、封装与采购信息

MMBT5401 由 DOWO(东沃)生产,SOT-23 小型封装利于自动化贴装与高密度布板。适合批量采购用于消费电子、仪表与通信终端等小型化产品。购买或设计导入前建议索取器件详细数据手册,核对实验条件下的典型曲线与极限值,以确保电路长期可靠运行。

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