WMSIC Electronic Components

DOWO SMB5349B

ModelSMB5349B
PackageSMB(DO-214AA)
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO SMB5349B
Type
DOWO
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
SMB5349B
Electronic Component
1
Package
SMB(DO-214AA)
Electronic Component
Zener Diode
Electronic Component
0.153g
Electronic Component
1
(Zzk)
125Ω
(Zzt)
2.5Ω
Electronic Component
BM0228586606
Diode
1
Power Dissipation(Pd)
5W
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMB5349B — DOWO 12V 5W 稳压二极管产品概述

一、产品概述

SMB5349B 是东沃(DOWO)推出的一款独立式稳压二极管,标称稳压值为 12V,额定耗散功率 5W,采用 SMB(DO-214AA)封装。器件设计用于作为并联(分流)稳压元件或电压钳位保护件,适合工业、汽车电子、消费类和通信设备中对中小功率稳压、基准或浪涌保护的需求。器件在宽温度范围内保持稳定性能,适应严苛环境应用。

二、主要参数与电气特性

  • 标称稳压值(Vz):12V(标称值)
  • 反向电流(Ir):2 μA @ 9.1V(表征在低于稳压区电压下的反向泄漏特性)
  • 耗散功率(Pd):5W(在规定环境与散热条件下的最大耗散)
  • 阻抗(Zzt):2.5 Ω(稳态动态阻抗,表明在测试电流下的电压随电流变化的阻抗特性)
  • 阻抗(Zzk):125 Ω(拐点/膝值处的动态阻抗,反映在低电流区的导通特性)
  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 封装:SMB (DO-214AA)
  • 类型:独立式稳压二极管(单只器件,非串联/集成组)

注:Zzt 和 Zzk 分别用于描述器件在稳态工作点与接近击穿膝部时的动态响应,具体测试电流与测量条件请参见完整产品数据表。

三、性能特点

  • 中等功率处理能力:5W 额定耗散满足多数中功率稳压与钳位应用。
  • 低静态漏电:Ir=2 μA(在 9.1V 条件下)适用于要求低待机泄漏的电路。
  • 低稳态阻抗:Zzt=2.5 Ω 在稳压区内可提供较稳定的电压调节能力,减小负载变化导致的电压波动。
  • 宽工作温度范围:-55 ℃ ~ +150 ℃,适应苛刻环境与汽车级应用需求。
  • SMB 封装:便于表面贴装生产,热容和散热性能优于更小封装。

四、典型应用场景

  • 供电轨并联稳压与过压钳位(板级 12V 参考/保护)
  • 对瞬态浪涌的钳位保护(与限流电阻或其他保护措施结合)
  • 基本电压参考与偏置源(要求容忍一定误差与温漂)
  • 工业控制、仪表和通信设备的局部稳压
  • 汽车电子辅助稳压(需按车规要求进一步验证)

五、热设计与封装布局建议

  • 尽管器件标称耗散功率为 5W,但实际能耗能力受 PCB 散热条件影响较大。建议在器件两侧和底部使用较大铜箔面积以提高散热性能,并在必要时使用多层铺铜或散热垫。
  • 对于连续 5W 工作,应评估 PCB 上的热阻并在高温工况下进行功率余量计算与降额设计。
  • 建议在地/电源层使用热通孔(via)将顶层铜箔与内层/底层散热层连接,以降低结-周围环境的热阻。
  • SMB 封装在回流焊工艺下可靠,注意遵循封装承受的温度限制与焊接曲线(详见制造商工艺说明)。

六、使用要点与可靠性注意事项

  • 避免长期工作在额定功率的极限点;在设计中应预留安全余量以延长寿命并保证稳定性。
  • 对于涉及大脉冲或浪涌能量的场合,应配合限流器件或瞬态抑制元件,以保护稳压二极管免受过热损坏。
  • 在实际应用中,应参考完整数据表中提供的稳压特性曲线、温度系数与最大额定值以完成电路仿真与可靠性评估。
  • 储存与使用环境应避免潮湿、高温或腐蚀性气氛,以防焊盘氧化与封装劣化。

七、选型建议与替代方案

选择 SMB5349B 时,除了注重标称 12V 与 5W 的匹配外,应关注实际工作电流点对应的动态阻抗(Zzt)、漏电流与温漂特性。如需更低稳态阻抗或更高功率余量,可考虑功率更高或专为低阻抗优化的型号;如对封装体积有严格限制,可在保证功率与电气特性匹配的前提下查找同类 SMB/DO-214AA 封装的替代品。最终替代与并用请以原厂规格书与可靠性测试为准。

八、资料与订购

  • 产品型号:SMB5349B
  • 品牌:DOWO(东沃)
  • 封装:SMB (DO-214AA)
  • 订购前建议获取并审阅东沃提供的完整数据手册与器件样本测试报告,以确认所有工作条件下的电气与热特性满足设计要求。若需样品、长期供货或车规等级认证信息,请联系供应商或东沃渠道获取进一步支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.