Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
DOWO SMD3216-200N SMD3216
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DOWO SMD3216-200N
- Type
- DOWO
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- DOWO
- Electronic Component
- SMD3216-200N
- Electronic Component
- 1
- Electronic Component
- 1.6mm
- Package
- 1206
- Electronic Component
- 2
- Electronic Component
- (GDT)
- Electronic Component
- ±30%
- Electronic Component
- 0.07g
- Electronic Component
- 3.2mm
- Electronic Component
- 1.6mm
- Electronic Component
- 1
- Electronic Component
- BM0263667853
- Operating Temperature
- 40℃~+85℃
- Capacitor
- 0.3pF
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMD3216-200N 产品概述
一、产品简介
SMD3216-200N 为东沃（DOWO）推出的贴片陶瓷气体放电管（GDT），封装1206（尺寸3.2×1.6×1.6mm），两极设计，专为中低压电路的浪涌与雷击脉冲保护而生。该器件在直流击穿电压200V附近触发，能承受高达500A的脉冲放电电流，适用于通信、电源与信号线防护。
二、主要特点
- 额定直流击穿电压（Vdc）：200V（公差±30%）；
- 冲击击穿电压（Vimp）：750V；
- 脉冲放电电流：500A（峰值）；
- 极间电容：0.3pF，低电容设计对高速信号影响小；
- 工作温度范围：-40℃ ~ +85℃；
- 小型SMD封装，适合自动化贴装与空间受限应用。
三、电气与机械参数
- 极数：2；
- 精度（击穿电压公差）：±30%；
- 长×宽×高：3.2mm × 1.6mm × 1.6mm（1206封装）；
- 低漏电、快速触发特性，抗多次脉冲能力良好。
四、典型应用场景
- 宽带与窄带通信设备的线路防雷与浪涌保护；
- 电源输入与适配器的中低压浪涌抑制；
- 工业控制系统、智能电表、安防设备等对瞬态高压有抑制需求的场合；
- 与PTC、TVS二合一防护网络中作为主冲击能量吸收元件。
五、选型建议与注意事项
- 若工作电压接近击穿点，应考虑留有裕量或选择更高Vdc规格；
- 对高速信号线选用时，0.3pF低电容优势明显，但需评估寄生电感对带宽的影响；
- 公差±30%表明触发电压存在较大分布，系统设计需允许触发电压波动。
六、存储与焊接建议
- 推荐常温干燥环境存储，避免潮湿以防焊接缺陷；
- 满足回流焊温度曲线的SMD兼容性，建议遵循厂家回流温度规范；
- 焊盘设计与锡膏量需匹配1206封装，确保机械强度与可靠接触。
七、可靠性与测试
- 建议在设计验证阶段进行多次脉冲冲击测试与老化测试以确认重复触发能力；
- 对ESD、雷击标准（如IEC 61643系列）下的表现应按系统需求评估。
SMD3216-200N 以其小型化、低电容与高脉冲承受能力，适合要求空间紧凑且需可靠浪涌防护的应用场景。选择时请结合实际工作电压、脉冲能量及系统容忍度进行匹配。若需更详细的参数曲线或封装图纸，可联系供应商获取完整数据手册。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
