WMSIC Electronic Components

DOWO BZT52C7V5S

ModelBZT52C7V5S
PackageSOD-323
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO BZT52C7V5S
Type
DOWO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
BZT52C7V5S
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
0.039g
Electronic Component
1
(Zzk)
80Ω
(Zzt)
15Ω
Electronic Component
BM0264548657
Diode
1
Current(Ir)
1uA
Power Dissipation(Pd)
200mW
Electronic Component
7V~7.9V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C7V5S(DOWO 东沃)产品概述

一、产品简介

BZT52C7V5S 是东沃(DOWO)推出的一款小功率齐纳稳压二极管,采用 SOD-323 小封装,单只独立式器件。该型号标称稳压值为 7.5V,稳压范围 7.0V~7.9V,具有低击穿阻抗、良好的稳压性能与高可靠性,适用于便携式电子设备的基准/保护、低功耗局部稳压及浪涌钳位等场合。

二、主要电气参数

  • 稳压值(标称):7.5V
  • 稳压值范围:7.0V ~ 7.9V
  • 反向电流(Ir):1 μA(规格条件下)
  • 耗散功率(Pd):200 mW(最大)
  • 动态阻抗(Zzt):15 Ω(典型/测试条件下)
  • 低电流阻抗(Zzk):80 Ω(典型/测试条件下)
  • 封装:SOD-323,表面贴装

三、特点与优势

  • 低击穿阻抗:在工作点附近具备较小的动态阻抗,提升稳压精度、减小纹波影响。
  • 小型封装:SOD-323 尺寸紧凑,利于高密度 PCB 布局和便携设备应用。
  • 低漏电:典型反向电流仅为 1 μA,有利于低功耗系统的静态能耗控制。
  • 可靠性高:结构与工艺稳定,适合长期可靠运行的消费类和工业级应用。
  • 最大功率耗散 200 mW:满足轻负载稳压与瞬态吸收需求,但需注意热管理。

四、典型应用场景

  • 参考电压源与低功耗局部稳压电路
  • 电源浪涌钳位与瞬态过压保护
  • 信号线夹位与基准源
  • 便携式设备、消费电子、测量仪器中对高稳定性电压需求的场合

五、使用与设计注意事项

  • 功率与散热:SOD-323 为小尺寸封装,尽管最大耗散为 200 mW,但在实际 PCB 环境中需考虑布局与铜箔散热,建议在器件长期工作时按功率热降额设计,避免接近最大耗散值。
  • 串联限流电阻计算:在作齐纳并联稳压时,串联电阻 Rs 的选择应满足在无负载和有负载情况下齐纳电流 Iz 在合适范围内。基本关系:Iz = (Vin − Vz) / Rs − Iload;齐纳功耗 Pz = Vz × Iz,不应超过 Pd。
  • 工作电流与阻抗:尽量在器件推荐的测试/工作电流附近使用,以发挥低 Zzt 的稳压优势;过低电流下阻抗(Zzk)上升,稳压精度下降。
  • 反向漏流:在极低工作电流与高温条件下,漏电可能上升,影响超低功耗设计,应在电路仿真或样机测试中确认。
  • 焊接与温度:遵循制造商提供的回流焊接温度曲线,避免过高温度损伤封装或改变参数稳定性。

六、封装与选购

  • 封装形式:SOD-323,适合自动贴装与回流焊流程。
  • 品牌与型号:DOWO(东沃)出品,型号 BZT52C7V5S。采购时请注意确认完整规格书与批次,必要时索取样品进行电路验证。

总结:BZT52C7V5S 为一款面向小功率、要求高稳压精度与低漏电的齐纳二极管,SOD-323 小封装便于集成于便携与高密度电路中。在设计中需关注功率限值与散热条件,合理选择工作电流与串联元件以保证长期稳定可靠运行。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.