WMSIC Electronic Components

DOWO MMBT3904T

ModelMMBT3904T
PackageSOT-523
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO MMBT3904T
Type
DOWO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
MMBT3904T
Electronic Component
1
Package
SOT-523
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.029g
Electronic Component
1
Electronic Component
BM0257638257
Transistor Type
NPN
Frequency(f T)
300MHz
Power Dissipation(Pd)
150mW
Electronic Component
Electronic Component
Electronic Component
3000
Collector Current(Ic)
200mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMBT3904T 产品概述

一、主要特性

MMBT3904T(品牌:DOWO/东沃)是一款小尺寸 SOT-523 封装的 NPN 通用晶体管,适用于低功耗开关与小信号放大。关键参数包括:集电极电流 Ic = 200mA、集—射击穿电压 Vceo = 40V、耗散功率 Pd = 150mW、特征频率 fT = 300MHz、集电极截止电流 Icbo = 50nA、集—射极饱和电压 VCE(sat) ≈ 300mV(在常见几十毫安级工作点)、射—基击穿电压 Vebo = 6V。数量:1只,描述未分类。

二、典型电气参数(便于快速查看)

  • 类型:NPN
  • Ic(max):200mA(脉冲或短时峰值)
  • Vceo:40V
  • Pd:150mW(封装热极限,需按环境温度降额)
  • fT:300MHz(适合小信号放大、高速开关)
  • Icbo:50nA(低漏电,偏置稳定)
  • VCE(sat):约300mV(几十毫安级)
  • Vebo:6V

三、主要应用场景

  • 低功耗开关电路(逻辑驱动、LED 驱动小电流场合)
  • 小信号放大(前置放大、收发器输入级,工作频率可达 VHF 低端)
  • 高频开关与脉冲电路(受限于封装散热与功率)
  • 移动设备、便携仪器、传感器接口等空间受限场合

四、设计与使用建议

  • 注意功耗限制:Pd = 150mW 为封装极限,实际使用需按环境温度与 PCB 散热降额。例如当 VCE = 10V 时,可连续通过的理论集电极电流约为 150mW/10V = 15mA;因此尽管 Ic 标称 200mA,持续工作时应避免大电流高 VCE 状态。
  • 开关驱动:使用时在基极串联限流电阻以控制基极电流 IB,保证饱和且避免过热。计算 IB ≈ IC/β(sat),并留安全裕量。
  • 反向电压:基极-射极反向电压 Vebo = 6V,不要在电路中反向施加较大电压以免损坏结。
  • 高频特性:fT = 300MHz 表明适合用于几十至数百 MHz 的小信号场景,但布局与寄生电容会显著影响实际带宽,布线要短且走地平面良好。

五、封装与热管理

SOT-523 为极小型封装,体积小但散热能力有限。建议:

  • 在器件下方或近旁设计足够铜箔和热铺铜,必要时增加过孔与底层散热面。
  • 通过 PCB 热阻和环境温度进行 Pd 降额计算,避免长时间高功耗运行。
  • 小封装在波峰/回流焊时注意温度曲线与回流规范,防止过热导致可靠性问题。

六、品质与选型提示

  • 在批量设计前建议向供应商(DOWO/东沃)获取正式数据手册,核对引脚定义、典型电气曲线与封装尺寸。
  • 若应用需长期大电流或更高耗散,请选用更大封装或专用功率晶体管。
  • 对 ESD 敏感性和存储、焊接条件(湿敏等级)有要求时,向厂家确认相关规范。

总结:MMBT3904T 以其小体积、良好的频率特性和通用的开关/放大能力,适合空间受限且功耗有限的电子设计。在使用时应重点关注封装热限制与实际连续电流能力,合理布局与限流设计可确保稳定可靠的工作。

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