WMSIC Electronic Components

DOWO ESD73034D

ModelESD73034D
PackageDFN2510-10L
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO ESD73034D
Type
DOWO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
ESD73034D
Electronic Component
1
Package
DFN2510-10L
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.026g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.13pF
Electronic Component
BM0264866320
Voltage
6.5V
Electronic Component
IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
500nA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESD73034D — 3.3V 双向四路高性能ESD保护器件(DOWO)

一、主要特性

ESD73034D 为 DOWO(东沃)出品的双向四路瞬态抑制二极管,专为 3.3V 信号线保护设计。主要参数如下:

  • 极性:双向(适用于无源/对称信号线)
  • 额定工作电压 Vrwm:3.3V
  • 击穿电压 VBR:5V(典型)
  • 钳位电压 Vc:6.5V(在 Ipp 条件下)
  • 峰值脉冲电流 Ipp:6A(8/20µs)
  • 反向泄漏电流 Ir:500nA(在 Vrwm)
  • 结电容 Cj:0.13pF(极低电容,适合高速信号)
  • 通道数:4 路
  • 封装:DFN2510-10L(小尺寸表面贴装)
  • 防护等级:符合 IEC 61000-4-2(ESD)与 IEC 61000-4-5(浪涌)

二、产品优势

  • 低结电容(0.13pF)对高速数据线影响极小,适合对信号完整性要求高的接口。
  • 双向结构可直接保护差分或双向信号(如数据线、串行接口等),无需外加偏置。
  • 6A@8/20µs 的峰值脉冲承受能力,能有效吸收雷击/浪涌导入的短时能量。
  • 封装小巧,便于对 PCB 密集布局的保护设计。

三、典型应用场景

  • 3.3V 系统的高速数据信号保护(如串口、I²C、SPI、无线模块接口等)
  • 消费电子、通信设备、工业控制终端的接口防护
  • 智能终端、传感器前端与外部连接器的ESD/浪涌防护

四、封装与布局建议

  • 封装:DFN2510-10L,适合自动贴装与回流焊接。
  • 布局建议:将器件尽量靠近被保护的连接器或线缆入口,走线最短、最直;保护器件的地端(或公共端)应通过短、粗的回流地连接至系统地,并考虑多层板设置直通地 via 以降低感抗。对差分线应保持元素对称布线,避免在器件与受保护线之间引入串扰。

五、可靠性与合规

本器件设计用于满足 IEC 61000-4-2 ESD 以及 IEC 61000-4-5 浪涌抗扰度要求,在典型系统环境下能显著提高接口可靠性。出货前建议在目标系统上验证钳位电压与泄漏电流对电路工作的影响。

六、使用注意事项

  • 在高度灵敏的模拟或射频前端使用前,应验证 0.13pF 电容对带宽/匹配的影响。
  • 若被保护线常态承受高电压或高能量脉冲,需评估器件热耗散并考虑并联或更高能量等级的保护方案。
  • 参考厂商原理图与封装引脚定义进行 PCB 设计与焊接工艺设置,确保长期可靠性。

ESD73034D 以其低电容、较高脉冲承受能力与小型封装,适合为 3.3V 的多路高速接口提供高效的 ESD 与浪涌防护。若需更详细的电气特性曲线、封装尺寸图或推荐焊盘,请告知,我可提供进一步技术支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.