WMSIC Electronic Components

DOWO SR05-4A 5.5A SR05

ModelSR05-4A 5.5A
PackageSOT-23-6
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO SR05-4A 5.5A
Type
DOWO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
SR05-4A 5.5A
Electronic Component
1
Package
SOT-23-6
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.034g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.8pF
Electronic Component
BM0257638254
Operating Temperature
40℃~+85℃
Voltage
16V
Electronic Component
IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SR05-4A 5.5A ESD保护器件 产品概述

一、产品简介

SR05-4A 是东沃(DOWO)推出的一款四路单向ESD保护器件,采用SOT-23-6小外形封装,专为保护高速数据线和低压电源节点免受静电放电(ESD)和脉冲浪涌损害而设计。器件在保持极低寄生电容的同时,提供高能量吸收能力与低漏电流,特别适合对信号完整性和功耗敏感的便携及工业电子设备。

二、主要参数

  • 极性:单向
  • 通道数:四路
  • 工作反向截止电压 Vrwm:5 V
  • 击穿电压:6 V(典型)
  • 钳位电压:约 16 V(在 8/20 µs 浪涌条件下)
  • 峰值脉冲电流 Ipp:5.5 A(@8/20 µs)
  • 峰值脉冲功率 Ppp:80 W(@8/20 µs)
  • 反向漏电流 Ir:1 µA(典型)
  • 结电容 Cj:0.8 pF(典型)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 防护等级:符合 IEC 61000-4-2 ESD 抗扰度要求
  • 封装:SOT-23-6
  • 类型:ESD 保护器件

三、性能特点

  • 小封装、高集成:SOT-23-6 封装内集成四路保护通道,节省PCB空间,便于靠近接口布局。
  • 低结电容:典型 Cj = 0.8 pF,最大限度降低对高速信号的负载与失真,适合 USB、 HDMI、LVDS、I2C、SATA 等高速接口应用。
  • 有效的瞬态吸收能力:在标准 8/20 µs 浪涌测试波形下,器件能承受高达 5.5 A 的峰值脉冲电流并吸收最高 80 W 峰值功率,钳位电压约 16 V,能有效保护下游元件免受大能量冲击。
  • 低漏电流:反向漏电流仅 1 µA,适合低功耗、待机敏感的应用场景。
  • 宽温度范围:支持 -40 ℃ 至 +85 ℃ 工作温度,满足多数消费电子与工业用途的可靠性要求。
  • 符合 IEC 61000-4-2:器件设计用于提高系统对静电放电的抗扰度,增强产品可靠性。

四、典型应用

  • 手机、平板、便携式设备的外部接口保护(例如 USB、耳机接口)
  • 笔记本、显示器与机顶盒的视频/音频接口(HDMI、DisplayPort)
  • 工业控制与通信设备的数据线保护(RS-485、CAN 总线、I2C、SPI)
  • 网络设备与终端设备的线路保护(以太网附属信号线)
  • 任何需要靠近接口布局以提高ESD防护的消费电子和工业产品

五、封装与引脚(简述)

SR05-4A 采用 SOT-23-6 小型封装,便于表面贴装与自动化生产。封装允许将保护器件靠近受保护的连接器或信号引脚放置,以缩短回路路径并提高保护效果。具体引脚功能与连接方式请参阅器件数据手册,以确定每一路信号线与公共接地引脚(或公共电源引脚)的布线关系。

六、设计与布局建议

  • 靠近敏感接口放置:将 SR05-4A 放置在被保护信号线的输入端,距离连接器或外部接触点越近越好(通常建议在 1–3 mm 范围内)。
  • 优化接地:提供低阻抗的接地路径,尽量采用多盲/过孔连接到主地平面,减少环路面积以提高放电回流能力。
  • 信号完整性考虑:由于器件具有低结电容(0.8 pF),对高频信号影响小,但仍建议在高速/差分线对应用中评估时域与频域影响。
  • 严禁替代使用高阻抗或长回流路径的保护元件,否则会降低 ESD 吸收效果并可能引起二次损伤。

七、使用与环境注意事项

  • 本器件适合用于保护低电压(典型 Vrwm = 5 V)系统,对超过推荐工作电压的环境应谨慎评估。
  • SR05-4A 针对瞬态脉冲吸收设计,不能作为替代长期通电或持续高功率限流器件使用。
  • 在高湿、高腐蚀或极端振动环境下,应配合封装防护措施与系统级防护策略使用,以保证长期可靠性。
  • 参考制造商的焊接与回流曲线,以避免封装损伤和硫化问题。

八、结论与选型建议

SR05-4A 5.5A 四路单向 ESD 保护器件以其高能量吸收能力、低结电容与小型化封装,成为对高速信号与低压接口实施近端保护的理想选择。对于需要在有限空间内保护多个信号线且对信号完整性要求较高的消费电子、通信与工业设备,SR05-4A 提供了平衡的性能与可集成性。选择时请根据系统工作电压、最大可承受浪涌能量以及PCB布局条件综合评估,必要时参考样片测试与制造商的应用说明。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.