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DOWO MMSZ5V1
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DOWO MMSZ5V1
- Type
- DOWO
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- DOWO
- Electronic Component
- MMSZ5V1
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Zener Diode
- Electronic Component
- 0.034g
- Electronic Component
- 1
- (Zzk)
- 480Ω
- (Zzt)
- 60Ω
- Electronic Component
- BM0231093701
- Diode
- 1
- Current(Ir)
- 2uA@2V
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- 4.85V~5.36V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMSZ5V1 产品概述
一、主要规格参数
MMSZ5V1（DOWO/东沃，SOD-123封装）是一款5.1V稳压二极管，适用于小功率稳压与浪涌保护。关键参数如下：标称稳压值 5.1V；稳压值允许范围 4.85V～5.36V；反向漏电流 Ir = 2µA（在 2.0V 条件下）；耗散功率 Pd = 500mW；动态阻抗 Zzt = 60Ω，Zzk = 480Ω。封装为SOD-123，适合贴片组装与紧凑设计。
二、主要特性与电气性能
该器件在规定测试点附近提供稳定的电压基准，Zener 动态阻抗 Zzt = 60Ω 表明在中等工作电流下具有较低的小信号阻抗，而 Zzk = 480Ω 表示在击穿起始区或低电流区阻抗较高，稳压特性随电流变化明显。反向电流 2µA（2V）提示在较低偏压下漏电小，适合低功耗待机电路。最大稳态功耗 500mW，对应在 Vz≈5.1V 时的理论最大电流约为 98mA（Imax ≈ Pd/Vz），实际应用中需留余量以保证可靠性。
三、封装与热性能
SOD-123 小型表贴封装便于自动贴装与高密度布板，但热阻相对较大，散热能力受限。建议在PCB上为该封装提供适当的铜箔散热区和热沉措施，以提高耗散能力并降低结温。长期使用时应对功耗进行热仿真或测量，并按环境温度对耗散功率进行相应降额。
四、典型应用场景
- 作为稳压基准（小电流场合）用于传感器、模拟前端和微控制器的基准或保护。
- 过压或浪涌钳位：用于接口、通讯线或电源线上对瞬态过压进行限制。
- 简易稳压电路：与串联限流电阻配合，可构成低成本的5.1V稳压源（适用于负载电流较小时）。
示例计算：若输入 12V，期望稳压电流 Iz=10mA，则限流电阻 R=(12-5.1)/0.01≈690Ω，实际应考虑功耗与温升。
五、选型与使用建议
- 在设计中应保证稳压二极管工作电流处于其稳压区，以发挥较低动态阻抗的优势；避免长期靠近最大耗散功率工作。
- 对于更高精度或更大电流需求，考虑更大功率或精密基准源替代。
- PCB 布局上尽量增大焊盘和散热铜箔，减少结温，并为重要信号增加旁路与滤波处理以减少噪声对稳压精度的影响。
- 在多个候选器件中核对温度特性、稳压曲线和包装兼容性，确保在目标工况下满足长期可靠性。
总结：MMSZ5V1（SOD-123）适合低功耗、空间受限的稳压与过压保护场合，具有成本低、易于贴装的优点，但需注意功耗、热管理及工作电流选择以保证稳定性与寿命。
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