Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1N5824 为 DOWO(东沃)出品的一款功率肖特基整流二极管,采用 DO-201AD 轴向封装,适用于中等功率整流和保护电路。该器件以低正向压降和优良的浪涌承受能力见长,适配工业级温度要求,适合要求高可靠性的电源模块和功率控制应用。
1N5824 的正向压降约 0.55V(5A 条件),相较传统硅整流器能显著降低整流损耗与发热,提升转换效率。150A 的峰值浪涌能力保证了器件在启动、短路或电容充电时的抗冲击能力。宽温区间(-65℃~150℃)使其可用于汽车电子、通信设备及工业电源等恶劣环境中。DO-201AD 轴向封装可靠、便于穿孔安装并具有良好机械强度。
选择时除参考 Vr、Io、Ifsm、Vf、Ir 等关键参数外,应关注实际工作环境的结温与散热条件。建议在高电流持续工作时做适当电流降额与强制散热处理;长时间处于高温或高反向电压时反向漏电随温度上升显著增加,应核对电路容忍度。若需替代型号,务必保证封装、电流、电压及浪涌能力相当,并优先参考原厂 datasheet。
DO-201AD 为轴向引线封装,常用于穿孔焊接。焊接时避免长时间高温加热以防封装或内部结构受损;引线弯折应在离封装一定距离处进行,避免对端帽或内部接合点施加机械应力。储存与焊接操作遵循常规电子元件防潮、防冲击及防静电规程。
综上,1N5824 是一款适用于中功率、高冲击、宽温工作环境的肖特基整流器,凭借低正向压降与良好的浪涌承受能力,在电源与保护电路中具备良好实用性。具体电路设计与热设计细节建议参照生产厂家的完整规格书与应用说明。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products