WMSIC Electronic Components

DOWO M520

ModelM520
PackageDO-214AC(SMA)
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO M520
Type
DOWO
Minimum package
5000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
M520
Electronic Component
1
Package
DO-214AC(SMA)
Electronic Component
General Purpose Diode
Electronic Component
0.11g
Electronic Component
1
Electronic Component
BM0228586610
Current
1A
Diode
Electronic Component
Current(Ir)
2uA@1kV
(Vf)
1.2V@1A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

M520 产品概述

一、产品简介

M520 是 DOWO(东沃)推出的一款高压通用整流二极管,采用 DO-214AC(SMA)独立式封装,面向高压直流整流与保护应用。器件在 1A 工作电流条件下典型正向压降为 1.2V,反向耐压高达 2kV,兼顾高压耐受性与尺寸效率,适配表面贴装回流焊工艺,便于自动化生产。

二、主要电气参数

  • 正向压降 Vf:1.2V @ If = 1A
  • 直流反向耐压 Vr:2000V (2kV)
  • 额定整流电流:1A(连续)
  • 反向漏电流 Ir:2μA @ Vr = 1kV
  • 非重复峰值浪涌电流 Ifsm:30A(单次脉冲)
  • 工作结温范围:-55℃ ~ +150℃

三、主要特性与优势

  • 高压耐受:2kV 反向耐压满足高压整流与耐压保护需求。
  • 低漏电:在 1kV 条件下反向漏电仅 2μA,适合对漏电要求严格的高压回路。
  • 良好浪涌能力:30A 单次浪涌能力适用于开机冲击与短时过流事件。
  • 紧凑封装:DO-214AC(SMA)体积小,适合空间受限的高压电源与模块化设计。

四、典型应用场景

  • 高压直流电源与整流电路(高压偏置、倍压电路)
  • 工业测量与高压检测设备
  • 医疗影像、高压检测与校准仪器(需配合系统级安全设计)
  • 高压开关、孤岛保护与过压抑制电路

五、封装与装配建议

M520 采用 DO-214AC(SMA)独立式表面贴装封装,兼容自动贴片与回流焊工艺。为保证热量传导与可靠性,建议:

  • 设计合理的 PCB 散热铜箔与热过孔以降低结温;
  • 在高平均功率场合对器件进行降额使用,控制结温在安全范围内;
  • 回流焊曲线遵循焊料厂商与 PCB 工艺规范,避免超温。

六、可靠性与使用注意

  • 避免长期在高结温、高漏电状态下工作,必要时加装散热或限流保护;
  • 浪涌能量受脉冲宽度与热环境影响,Ifsm 为非重复峰值,应避免频繁重复冲击;
  • 储存与装配时注意防静电、防潮,遵循元器件厂商的存储条件与焊接指南。

总结:M520 以其 2kV 高反向耐压、低漏电与紧凑 SMA 封装,为高压整流与保护提供了可靠、易用的解决方案。设计时结合合适的 PCB 散热与保护电路,可在多种高压应用中实现稳定工作。若需器件焊接资料、推荐封装尺寸或详细电气曲线图,请提供进一步需求以便获取规格书支持。

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