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TA-I RM04JTN103
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RM04JTN103
- Type
- TA-I Technology
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- RM04JTN103
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.009g
- Electronic Component
- 10kΩ
- Electronic Component
- 1
- Electronic Component
- BM0264717403
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±200ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RM04JTN103 厚膜片式电阻产品概述
RM04JTN103是大毅科技推出的通用型厚膜片式电阻，以0402小型封装为核心，兼顾低功耗、宽温适应性与成本优势，广泛适配消费电子、工业控制等场景。以下从多维度解析其产品特性：
一、产品定位与封装特性
RM04JTN103属于通用厚膜片式电阻，采用0402英寸封装（尺寸约1.0mm×0.5mm×0.3mm），是当前PCB高密度设计的主流小型封装之一。其厚膜工艺基于氧化铝陶瓷基底，通过丝网印刷电阻浆料、高温烧结成型，既规避了薄膜电阻的高成本，又比线绕电阻更适合表面贴装（SMT）生产线的高速组装，平衡了性能与量产效率。
二、核心电气参数详解
- 阻值与精度：标称阻值10kΩ，精度±5%，满足90%以上通用电路的阻值匹配需求（如信号分压、滤波、上拉/下拉电阻），无需额外匹配精密电阻，适配批量应用。
- 功率与电压：额定功率1/16W（即62.5mW），最大工作电压50V，计算可得最大允许电流约1.25mA（I=P/U=62.5mW/50V），完全适配低功耗电路（如智能穿戴、小型传感器模块），避免过载风险。
- 温度系数：±200ppm/℃，即温度每变化1℃，阻值漂移±0.02%。例如，环境温度从25℃升至125℃（变化100℃），阻值变化约±2%，在工业级温变场景下仍能保持稳定电气性能。
三、环境适应性与可靠性
RM04JTN103的工作温度范围覆盖**-55℃至+155℃**，超出一般工业级（-40℃~+125℃）与汽车电子级（部分场景）的温度需求，可在极端温差环境下长期稳定运行。其厚膜结构（陶瓷基底+厚膜电阻层+金属电极）具备较强的抗冲击、抗振动能力，适合移动设备（如智能手表）或 harsh环境（如户外工业传感器）；同时符合RoHS无铅标准，环保无毒，满足全球市场环保要求。
四、典型应用场景
RM04JTN103的小型化、宽温与低功耗特性，使其适配多类场景：
- 消费电子：手机、平板、智能穿戴的信号滤波、按键分压电路（0402封装适配设备小型化趋势）；
- 工业控制：小型PLC辅助电路、温度传感器接口（宽温范围适配现场温差）；
- 汽车电子：车载显示屏背光控制、胎压监测模块信号电阻（满足汽车级温度需求）；
- 通信设备：路由器、交换机的高密度PCB电阻（0402封装支持PCB高密度布线）。
五、品牌与品质保障
大毅科技作为专业电子元器件制造商，RM04JTN103经过严格可靠性测试（高低温循环、湿度老化、振动测试），批次一致性达行业领先水平，避免批量生产中的阻值偏差问题。同时，大毅具备稳定的供应链体系，可满足客户批量供货需求，适合中大型电子厂商量产应用。
综上，RM04JTN103以高性价比、宽温适应性与小型化优势，成为通用电路设计的主流选择。
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