WMSIC Electronic Components

TA-I RLS12FTCR030

ModelRLS12FTCR030
Package1206
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RLS12FTCR030
Type
TA-I Technology
Minimum package
4000 圆盘

Technical parameters

Power
1W
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RLS12FTCR030
Electronic Component
1
Package
1206
Electronic Component
Current Sense Resistor / Shunt
Electronic Component
±1%
Electronic Component
0.03g
Electronic Component
30mΩ
Electronic Component
1
Electronic Component
BM0264549162
Electronic Component
SMD
Electronic Component
±50ppm/℃
Resistor Type
Current Sense Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RLS12FTCR030 — 大毅科技 1206 采样电阻(30mΩ / 1W / ±1% / ±50ppm/℃)产品概述

一、产品简介

RLS12FTCR030 是大毅科技推出的一款用于电流采样与分流测量的贴片电阻器,封装为业界常用的1206型号。标称阻值为30 mΩ(0.03 Ω),额定功率 1W,初始精度 ±1%,温度系数(TCR)为 ±50 ppm/℃。该器件针对低阻值、高精度的电流检测场景设计,可在电源管理、BMS、电机驱动和精密测量等应用中提供稳定、可重复的电流采样性能。

二、关键参数与电气性能

  • 阻值:30 mΩ(0.03 Ω),适合低压降、高电流测量场合。
  • 初始精度:±1%,满足对瞬时电流测量有较高精度要求的系统。
  • 额定功率:1W(在良好散热条件下),对应的连续工作电流约为 √(1W/0.03Ω) ≈ 5.77A,电压降约为 5.77A × 0.03Ω ≈ 0.173V。
  • 温度系数:±50 ppm/℃,在典型工作温度变化下具有较好的温漂控制。举例:温度从 25℃ 上升到 75℃(ΔT = 50℃)时,理论电阻变化约为 50 ppm/℃ × 50℃ = 2500 ppm = 0.25%,对整体测量精度影响较小。
  • 封装与安装:1206 贴片封装(公认尺寸约 3.2 mm × 1.6 mm),适合自动贴装与回流焊工艺。

三、典型应用场景

  • 电池管理系统(BMS):电池充放电电流监控与均衡控制。
  • 开关电源与DC-DC转换器:输出电流检测、过流保护与功率测量。
  • 电机驱动与伺服系统:实时电流反馈与闭环控制。
  • 通信与服务器电源监控:高密度电源板卡的电流计量与告警。
  • 工业与新能源汽车电子:需要在较大电流下保持低电压损耗与高测量精度的场合。

四、布局与热设计建议

  • 锡焊与散热:尽量使用大铜面、加宽走线和过孔,将热量导入内部或底层铜箔,提高散热能力,从而保证接近 1W 的额定功率长期可靠工作。
  • Kelvin 四端测量:由于阻值极低,建议采用四端(Kelvin)测量或在 PCB 上引出独立的测量引线,以避免引线和焊盘阻抗对测量结果的影响。
  • 走线布局:采样电阻应尽量靠近电流源或负载,电源大电流端与测量端走线短且粗;差分放大器(电流检测放大器)输入布线应短且成对,以减小共模干扰。
  • 热退化与功率退化:SMD 低阻电阻的实际可用功率受 PCB 散热条件影响明显,建议在系统设计时查看或咨询厂商的功率-温度退载曲线并适当留裕量。

五、使用注意事项与可靠性

  • 温度漂移:±50 ppm/℃ 的 TCR 已属中高性能水平,但在精密测量场合仍需对环境温度变化进行补偿或校准。
  • 长期稳定性:建议在生产和校准阶段对关键测量点进行零点和增益校准,以补偿器件的初始容差与长期漂移。
  • 焊接工艺:遵循无铅回流焊温度曲线与厂商推荐的最大加热时间;避免过长高温暴露以减少性能漂移。
  • 过载与脉冲能力:短时脉冲电流通常能超出额定值,具体脉冲能力建议参考厂商脉冲功率/时间数据或进行实际测试验证。

六、选型与采购参考

  • 型号:RLS12FTCR030(大毅科技)
  • 核心规格汇总:30 mΩ、1W、±1%、±50 ppm/℃、1206 贴片封装。
  • 选型提示:若系统要求更低电压降或更高持续电流,可考虑更低阻值或更大封装/更高功率等级的采样电阻;若对测量精度要求更高,考虑四端结构或更低 TCR、低漂材料的产品。
  • 采购与样片测试:在批量采购前建议索取样片并在目标 PCB 与实际工作条件下进行热稳定性与测量精度验证。

结论:RLS12FTCR030 以其 30 mΩ 的低阻值、±1% 的初始精度和 ±50 ppm/℃ 的温漂特性,适合多种中高电流的电流采样应用。合理的 PCB 散热和测量布局能充分发挥其性能,满足电源管理、动力与工业控制等场景的可靠电流检测需求。若需更详细的电气特性曲线、封装尺寸图或回流焊工艺建议,可联系大毅科技获取规格书与技术支持。

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