WMSIC Electronic Components

TA-I RMS04JT621

ModelRMS04JT621
Package0402
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RMS04JT621
Type
TA-I Technology
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RMS04JT621
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.009g
Electronic Component
620Ω
Electronic Component
10
Electronic Component
BM0265676253
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RMS04JT621 厚膜贴片电阻产品概述

RMS04JT621是大毅科技推出的一款小型化厚膜贴片电阻,专为低功耗、高密度电子电路设计,具备稳定的电气性能和宽温适应性,广泛适用于消费电子、工业控制及汽车电子等领域。

一、产品基本识别

该产品型号遵循行业通用编码规则,各部分含义清晰:

  • RMS:大毅科技厚膜贴片电阻系列标识;
  • 04:封装规格代码,对应英制0402封装;
  • JT:精度(±5%)及功率(62.5mW)的组合标识;
  • 621:阻值编码,前两位数字为有效数字(62),第三位为倍率(10¹),即62×10¹=620Ω。

产品类型为厚膜贴片电阻,封装为0402(公制尺寸约1.0mm×0.5mm),是大毅科技针对小型化电路开发的常规电阻型号。

二、核心参数规格

RMS04JT621的关键电气与物理参数均经过严格测试,满足通用电路设计需求:

  1. 阻值与精度:标称阻值620Ω,精度±5%,适用于对精度要求不苛刻的信号处理、分压等电路;
  2. 功率与电压:额定功率62.5mW,最大工作电压50V,需注意电路中实际功耗不得超过额定值,避免过热损坏;
  3. 温度特性:温度系数(TCR)±200ppm/℃,阻值随温度变化的可控性良好;
  4. 工作环境:工作温度范围-55℃~+155℃,可适应宽温环境;
  5. 封装尺寸:0402封装(长1.0mm×宽0.5mm×厚≈0.3mm),节省PCB空间,支持自动化贴装。

三、设计特点与制造优势

  1. 厚膜工艺稳定性:采用陶瓷基板+厚膜电阻浆料烧结工艺,电阻膜附着力强,耐温性优于薄膜电阻,长期使用阻值漂移小;
  2. 小型化适配性:0402封装体积小,适合智能手机、智能穿戴等高密度PCB设计,提升电路集成度;
  3. 批量一致性好:大毅科技的自动化生产流程确保同批次产品参数一致性,减少电路调试复杂度;
  4. 环保合规:符合RoHS、REACH等环保标准,无铅焊接兼容,满足全球市场要求。

四、典型应用场景

RMS04JT621的参数特性使其适用于以下场景:

  1. 消费电子:智能手机、平板的音频信号分压、电源滤波电路,以及智能穿戴的低功耗传感器调理电路;
  2. 工业控制:PLC、传感器模块的信号放大、限流电路,宽温范围适应车间高低温环境;
  3. 汽车电子:仪表盘指示灯驱动、车载小信号处理电路,155℃高温耐受满足车内高温工况;
  4. 通信设备:小型基站、路由器的低功耗信号分配电路,小型化封装适配设备紧凑结构。

五、可靠性与环境适应性

  1. 宽温稳定性:-55℃~+155℃的工作范围覆盖了大多数工业、汽车及户外应用场景,温度系数±200ppm/℃确保阻值变化在精度允许范围内;
  2. 耐环境性能:厚膜电阻对湿度、机械应力的耐受性较好,贴片封装焊接可靠性高,可通过常规回流焊、波峰焊工艺;
  3. 长期可靠性:经老化测试验证,产品在额定参数下长期使用阻值漂移率低,满足电子设备的使用寿命要求。

综上,RMS04JT621作为一款高性价比厚膜贴片电阻,以稳定的性能、小型化封装和宽温适应性,成为消费电子、工业及汽车电子领域的常规选型之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.