WMSIC Electronic Components

TA-I RM04FTN1100

ModelRM04FTN1100
Package0402
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RM04FTN1100
Type
TA-I Technology
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RM04FTN1100
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
110Ω
Electronic Component
10
Electronic Component
BM0263510272
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RM04FTN1100 厚膜片式电阻产品概述

RM04FTN1100是大毅科技推出的0402封装厚膜片式电阻,针对小型化、高密度贴装场景设计,具备稳定电气性能与可靠环境适应性,广泛覆盖消费电子、工业控制等领域的通用需求。

一、产品基本属性

该电阻属于厚膜固定片式电阻,封装规格为0402(英制0.04英寸×0.02英寸,公制0.4mm×0.2mm),是当前小型电子设备最常用的贴片电阻封装之一。品牌为台湾大毅科技,型号明确对应110Ω±1%、1/16W等核心参数,属于常规工业级厚膜电阻范畴。

二、核心性能参数详解

1. 阻值与精度

标称阻值110Ω,精度±1%,满足90%以上通用场景需求(如音频阻抗匹配、传感器信号放大反馈)。此精度属于“常规工业级”,若需精密仪器(如基准电路)需选±0.1%及以上精度的衍生型号。

2. 功率与电压额定值

  • 额定功率62.5mW(1/16W):对应0402封装厚膜电阻的典型功率等级,长期使用需留10%-20%余量(避免过载);
  • 最大工作电压50V:绝对额定值,需注意:额定功率下的实际电压仅约2.62V(√(0.0625×110)),若电压接近50V,电阻功率会远超额定(如50V时最大允许阻值仅25Ω),需严格避免高电压下的低阻值使用。

3. 温度特性

  • 温度系数±100ppm/℃:温度每变化1℃,阻值漂移±0.011Ω,满足-55℃~155℃范围内的稳定性;
  • 工作温度范围-55℃~+155℃:覆盖工业级(-40℃~85℃)与部分高温场景(如车载辅助模块),低温侧适配极寒地区设备。

三、适用应用场景

因0402封装体积小、贴装密度高,RM04FTN1100主要用于:

  1. 消费电子终端:智能手机、智能手表的主板电路(音频解码阻抗匹配、电源滤波分压);
  2. 小型物联网模块:低功耗传感器节点(温湿度/运动传感器)的信号调理电路;
  3. 工业控制模块:PLC输入输出接口、小型电机驱动的限流电阻;
  4. 车载辅助部件:中控屏背光控制、胎压监测模块信号电阻(需确认是否符合AEC-Q200汽车级认证,若需则选衍生型号)。

四、品牌与可靠性说明

大毅科技在厚膜电阻领域工艺成熟:

  • 采用丝网印刷+烧结工艺,电阻膜层均匀,批量阻值一致性达±0.5%以内;
  • 封装为陶瓷基板+环氧树脂涂层,抗跌落(1.5m跌落测试无失效)、抗盐雾(5%NaCl雾环境1000小时阻值漂移<0.5%);
  • 符合IEC 60115-1国际标准,可满足大规模量产的可靠性要求。

五、选型与使用注意事项

  1. 焊接工艺:仅适用回流焊/激光焊,避免波峰焊(易桥连);回流焊峰值温度240℃~260℃,持续时间≤10秒(过热会损坏封装);
  2. 存储条件:常温(25℃±5℃)、干燥(湿度≤60%)环境存储,受潮后需120℃烘烤4小时再使用;
  3. 精度匹配:若电路需精密基准(如医疗仪器),需选±0.1%精度电阻,该型号1%不适用;
  4. 功率余量:实际使用功率需≤50mW(留20%余量),避免长期过载导致阻值漂移。

该产品平衡了体积、性能与成本,是小型化电子设备中通用电阻的优选型号之一。

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