WMSIC Electronic Components

TA-I RMS04FT6193

ModelRMS04FT6193
Package0402
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RMS04FT6193
Type
TA-I Technology
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RMS04FT6193
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
619kΩ
Electronic Component
10
Electronic Component
BM0265427438
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RMS04FT6193 厚膜贴片电阻产品概述

RMS04FT6193是大毅科技推出的一款0402封装厚膜贴片电阻,专为高密度电路设计,兼具精准阻值控制、宽温域稳定性及高可靠性,可覆盖消费电子、工业控制、汽车电子等多领域的典型应用需求。以下从产品基本信息、核心参数、设计特性、应用场景及品牌保障等维度展开详细概述。

一、产品基本信息

RMS04FT6193的核心基本属性可通过型号与规格明确:

  • 品牌:大毅科技(Taiyo Yuden旗下被动元器件核心品牌之一,专注厚膜/薄膜电阻研发生产);
  • 电阻类型:厚膜贴片电阻(采用丝网印刷+高温烧结工艺,阻值一致性优于碳膜电阻,成本低于薄膜电阻);
  • 封装规格:0402(英制尺寸:0.04″×0.02″,公制尺寸:1.0mm×0.5mm),属于小型化贴片封装,适配高密度PCB布局;
  • 型号定义:RMS为大毅厚膜电阻系列标识,04对应0402封装,FT代表厚膜工艺,6193为阻值编码(前三位619为有效数字,第四位3为10的幂次,即619×10³Ω=619kΩ)。

二、核心参数详解

RMS04FT6193的关键电性能参数匹配0402封装的应用边界,具体如下:

1. 阻值与精度

  • 阻值:619kΩ(固定电阻,无可调结构);
  • 精度:±1%(属于工业级常规高精准等级,满足大多数分压、限流、信号调理电路的阻值误差要求)。

2. 功率与电压

  • 额定功率:62.5mW(0.0625W),对应0402封装的典型功率等级,可满足小电流电路的连续工作需求(例如:若电路工作电流为1mA,功率损耗为I²R=1mW,远低于额定功率);
  • 最大工作电压:50V(直流/交流有效值),确保电阻在高压场景下不发生击穿或绝缘失效。

3. 温度特性

  • 温度系数(TCR):±100ppm/℃(ppm为“百万分之一”,即温度每变化1℃,阻值变化±0.01%);
  • 工作温度范围:-55℃~+155℃(覆盖工业级、汽车级的典型环境温度,可适应极端高低温循环场景)。

4. 其他特性

  • 封装材料:陶瓷基片(Al₂O₃陶瓷,导热性好,可快速散发电功率损耗);
  • 端电极:锡铅或无铅合金(符合RoHS环保标准,适配回流焊工艺)。

三、设计特性与优势

RMS04FT6193的设计针对高密度、宽温域应用场景优化,核心优势包括:

1. 小封装高密度适配

0402封装尺寸仅为1.0mm×0.5mm,可显著节省PCB空间,适合智能手机、可穿戴设备、小型通信模块等对体积敏感的产品设计。

2. 宽温域稳定性

-55℃~+155℃的工作范围,结合±100ppm/℃的TCR,可确保在极端温度下阻值漂移极小(例如:温差210℃时,阻值变化仅为210×100ppm=2.1%,远低于精度要求的1%?此处需注意:实际应用中需结合精度与TCR综合考虑,若环境温度变化100℃,阻值变化1%,与精度叠加后总误差为±2%,仍满足大多数工业应用要求)。

3. 厚膜工艺的成本与性能平衡

厚膜电阻相比薄膜电阻成本更低,相比碳膜电阻阻值一致性更好、抗浪涌能力更强,适合量产场景下的性价比需求。

4. 可靠性与一致性

大毅科技的厚膜工艺确保批量产品的阻值、功率参数一致性,通过ISO9001、AEC-Q200(汽车级认证,若适配)等可靠性测试,可满足长期连续工作需求。

四、典型应用场景

RMS04FT6193的参数特性使其适配以下典型应用:

1. 消费电子领域

  • 智能手机/平板电脑:电池管理IC的分压电阻、音频电路的信号调理电阻;
  • 可穿戴设备:心率传感器的限流电阻、蓝牙模块的匹配电阻。

2. 工业控制领域

  • PLC(可编程逻辑控制器):模拟输入模块的限流电阻、数字输出模块的上拉电阻;
  • 传感器系统:温度传感器的信号放大电路分压电阻。

3. 汽车电子领域

  • 车载信息娱乐系统(IVI):音频放大器的反馈电阻;
  • 车身控制模块(BCM):门窗传感器的接口限流电阻(适配汽车舱内-40℃~+85℃的工作环境)。

4. 通信设备领域

  • 小型基站:射频前端的匹配电阻;
  • 路由器:电源模块的分压电阻。

五、品牌与质量保障

大毅科技作为全球知名被动元器件制造商,具备30余年厚膜电阻研发生产经验,RMS04FT6193系列产品:

  • 符合RoHS 2.0、REACH等环保法规要求;
  • 通过1000小时高温老化测试、高低温循环测试(-55℃~+155℃,1000次循环);
  • 批量供货一致性控制在±0.5%以内(优于标称±1%精度)。

总结

RMS04FT6193厚膜贴片电阻凭借0402小封装、±1%精准阻值、-55℃~+155℃宽温域、62.5mW额定功率等核心特性,成为高密度电路设计的理想选择,兼顾性能、成本与可靠性,可满足消费电子、工业控制、汽车电子等多领域的量产应用需求。

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