Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
大毅科技RLH12FTCR160是一款专为电流检测设计的贴片式高精度功率采样电阻,凭借低阻值、高功率密度与稳定的温度特性,广泛应用于电力电子、电源管理、电池管理等领域,是实现电流精准监控与控制的核心被动元件之一。
RLH12FTCR160属于电流采样电阻范畴,核心作用是将电路中的电流转换为可测量的电压信号(遵循欧姆定律(V=I×R)),为过流保护、恒流控制、功率监测等功能提供关键数据支撑。其0.16Ω(160mΩ)的低阻值特性可有效降低自身功耗对电路效率的影响,同时产生足够的电压降(如2A电流下为0.32V)便于后端检测电路(运放、ADC)识别,平衡了“低功耗”与“高检测灵敏度”的需求。
额定功率:1W,结合0.16Ω阻值,最大允许工作电流约为2.5A((I=\sqrt{P/R}=\sqrt{1/0.16}≈2.5A)),满足中小功率电路的电流采样需求;若降额使用(80%功率余量),可稳定承载2A电流,延长寿命。
温度系数:±100ppm/℃,表示环境温度每变化1℃,阻值变化百万分之一百。在-55℃~125℃的宽温范围内,温度变化180℃时,阻值最大变化量为(0.16Ω×100ppm×180=0.00288Ω),相对变化率约±1.8%,结合自身±1%精度,整体检测误差可控在±2.8%以内,保证温度波动下的采样稳定性。
0.16Ω的低阻值可最大程度降低电阻自身功耗(如1A电流下仅0.16W),同时产生可被常规检测电路识别的电压降,无需额外放大电路即可实现精准检测,简化电路设计。
采用1206封装(英制:0.12英寸×0.06英寸,公制:3.2mm×1.6mm),属于贴片电阻的常用尺寸,兼容性强,可适配多数自动化贴装生产线,同时节省PCB空间,适合高密度电路设计。
表面贴装(SMD)无引脚设计,支持回流焊工艺,生产效率高,且避免了插件电阻的体积大、安装工序复杂等问题,适合批量生产。
采用陶瓷基体(厚膜电阻工艺),散热性能优于塑料封装,可有效降低工作时的电阻温度(如2A电流下温度≤80℃),延长产品寿命;同时封装结构抗机械应力能力强,适合振动环境(如汽车电子、工业设备)。
大毅科技是专注于被动元件的知名厂商,在功率电阻、电感领域有20余年研发制造经验,产品覆盖工业、汽车、消费电子等领域,以高可靠性与稳定性著称。
该型号经过多项验证:
符合RoHS 2.0、REACH等国际环保标准,无铅无卤,可用于出口产品与绿色制造项目。
RLH12FTCR160凭借平衡的性能与可靠性,成为中小功率电流检测场景的高性价比选择,可满足多数工业与消费电子领域的电流采样需求。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products