WMSIC Electronic Components

TA-I RM06JTN470

ModelRM06JTN470
Package0603
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RM06JTN470
Type
TA-I Technology
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RM06JTN470
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.025g
Electronic Component
47Ω
Electronic Component
10
Electronic Component
BM0264899855
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RM06JTN470 厚膜贴片电阻产品概述

一、产品定位与基本属性

RM06JTN470是大毅科技推出的一款0603封装厚膜贴片电阻,属于通用型被动元器件,核心定位为低功耗、常规精度、高密度安装场景,兼顾成本控制与基础性能稳定,适配多数消费电子、工业控制等领域的基础电阻需求。

二、核心电气参数详解

该电阻的电气参数明确了性能边界,关键指标及实际意义如下:

  1. 阻值与精度:标称阻值47Ω,精度±5%——属于工业级常规精度范畴,满足非精密信号调理(如电压分压)、电源滤波等场景的阻值匹配需求,无需额外校准即可稳定工作;
  2. 额定功率:100mW——对应0603封装的典型功率等级,适配低功耗电路(如微控制器周边电路、小型传感器接口);需注意功率约束:(P=I^2R=V^2/R≤100mW),额定功率下最大电流约2.17mA((I=\sqrt{0.1W/47Ω}≈2.17mA));
  3. 工作电压:额定工作电压75V——指电阻不被击穿的电压上限(非额定功率下的电压范围),可覆盖部分高压低功耗场景(如小型高压电源的限流);
  4. 温度系数(TCR):±200ppm/℃——每变化1℃,阻值变化±0.0094Ω((ΔR=47Ω×200×10^{-6}×ΔT)),属于厚膜电阻的常规范围,能满足宽温环境下的阻值稳定性要求。

三、封装与制造工艺特点

  1. 0603封装:尺寸为0.06英寸×0.03英寸(约1.6mm×0.8mm),优势在于:
    • 适配高密度PCB设计,可有效节省电路板空间(比0805封装节省约50%面积);
    • 兼容回流焊、波峰焊等自动化焊接工艺,适合批量生产,焊接不良率低;
  2. 厚膜制造工艺:采用陶瓷基片印刷电阻浆料+高温烧结工艺,相比薄膜电阻:
    • 成本更低,适合大规模批量应用;
    • 抗电强度、耐机械应力(如焊接热应力)表现更优,可靠性更高。

四、环境适应性与可靠性

RM06JTN470具备较强的环境耐受能力,关键指标包括:

  1. 工作温度范围:-55℃+155℃——覆盖工业级(-40℃+85℃)及部分汽车电子(-40℃~+125℃)的温度需求,可适应极端高低温环境(如户外工业设备、车载低温启动场景);
  2. 长期可靠性:通过大毅科技的质量控制体系,产品经负载寿命测试(1000小时额定功率下阻值变化≤±1%)、温度循环测试(-55℃~+155℃循环1000次),保证长期使用性能稳定;
  3. 环保合规:符合RoHS、REACH等国际环保标准,无铅无镉,适配绿色电子产品设计。

五、典型应用场景

该电阻因尺寸小、功率适配、宽温耐受等特点,广泛应用于:

  1. 消费电子:手机、平板、智能穿戴的电源滤波、信号分压电路;
  2. 工业控制:小型PLC、传感器接口电路的电流限制、电压调节;
  3. 汽车电子:车载辅助电路(如仪表盘背光、低功耗传感器);
  4. 通信设备:小型基站模块、路由器的电阻网络设计。

六、品牌与质量背书

大毅科技作为专业被动元器件制造商,在厚膜电阻领域拥有10+年工艺积累:

  • 封装一致性好:0603封装尺寸公差控制在±0.1mm内,焊接兼容性强;
  • 供应稳定性高:年产能充足,可满足客户批量采购需求;
  • 质量体系认证:通过ISO9001、IATF16949等认证,产品可追溯性强,降低客户供应链风险。

综上,RM06JTN470是一款性价比突出的通用厚膜贴片电阻,能满足多数常规电子电路的基础电阻需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.