Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TA-I RLM12FTCMR018
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RLM12FTCMR018
- Type
- TA-I Technology
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 1W
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- RLM12FTCMR018
- Electronic Component
- 1
- Package
- 1206
- Electronic Component
- Current Sense Resistor / Shunt
- Electronic Component
- ±1%
- Electronic Component
- 0.03g
- Electronic Component
- 18mΩ
- Electronic Component
- 1
- Electronic Component
- BM0264549226
- Electronic Component
- SMD
- Electronic Component
- ±75ppm/℃
- Resistor Type
- Current Sense Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RLM12FTCMR018 — 18mΩ 1W 采样电阻产品概述
一、产品简介
RLM12FTCMR018 是大毅科技推出的一款贴片式电流采样电阻（分流器），封装为1206，标称阻值18mΩ，精度±1%，额定功率1W，温度系数（TCR）±75ppm/℃。该器件针对中低电流测量场景优化，适合板载电流检测与电源管理应用，兼顾低压降与较高测量精度。
二、主要特性
- 阻值：18mΩ（0.018Ω），初始精度 ±1%；
- 额定功率：1W（在规定环境与散热条件下）；
- 温度系数：±75ppm/℃，温度稳定性良好；
- 封装/安装：SMD 1206，便于自动贴装与回流焊工艺；
- 低压降设计，便于在电源轨上直接取样检测。
三、电气与热性能参考
- 最大瞬时电流（理想计算）：I_max = sqrt(P/R) ≈ 7.45A（在1W功耗限制下）；对应压降约0.134V。实际连续工作电流需按PCB散热条件与环境温度降额；
- 常见工况示例：5A 时损耗 P = I^2·R = 0.45W，电压降约0.09V；该功率下器件温升与长期可靠性更有保障；
- TCR ±75ppm/℃ 意味着每升高1℃阻值变化约0.0075%，大温差下阻值漂移仍属可控范围，与±1%初始精度配合可满足多数精确测量需求。
四、应用场景
- 开关电源与DC-DC转换器的电流检测与限流；
- 电池管理系统（BMS）与充放电监测；
- 电机驱动与负载电流反馈控制；
- USB/PoE/电源配电模块的过流保护与能耗统计；
- 与差分放大器、恒流源或电流检测芯片（INA/CS放大器类）配合使用，构成高精度电流测量链路。
五、设计与布局建议
- 采取低阻抗回流铜箔与散热铜皮，增大焊盘面积以改善散热及功率承载能力；
- 建议在走线处尽量短、粗，避免与高热源元件并排密集安放；若用于高侧测量，注意共模电压和放大器耐压等级；
- 在高精度测量场合，使用差分放大或运算放大器进行放大并加以滤波，减少共模与干扰影响；
- 焊接工艺遵循回流曲线，避免过热导致阻值漂移或封装损伤；如需焊接后校准，请在最终装配状态下进行测量补偿。
六、可靠性与合规
RLM12FTCMR018 采用标准1206贴片工艺，适配自动化生产与回流焊。产品满足一般工业级温度循环与机械可靠性要求（具体试验与认证请参见大毅科技正式数据表）。支持卷带（Tape & Reel）包装，便于SMT上料与批量生产，并符合常见环保规范（如RoHS）要求。
七、选型与订购建议
- 若系统允许较大压降或需更高精度，可考虑更低阻值或更高精度型号；反之需更大功率时选择大功率封装或多片并联降阻；
- 下单时确认阻值、精度、功率及包装形式（卷带长度），并参考厂商数据表的功率降额曲线与温度极限以保证长期稳定性。
如需电路接法示例、散热仿真建议或与特定放大器配合的设计指导，可提供电源电流范围与应用拓扑，我可给出更具体的工程建议。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
