WMSIC Electronic Components

TA-I Technology RLS12FTCR033

ModelRLS12FTCR033
Package1206
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RLS12FTCR033
Type
TA-I Technology
Minimum package
4000 圆盘

Technical parameters

Power
1W
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RLS12FTCR033
Electronic Component
1
Package
1206
Electronic Component
Current Sense Resistor / Shunt
Electronic Component
±1%
Electronic Component
0.03g
Electronic Component
33mΩ
Electronic Component
1
Electronic Component
BM0264549175
Electronic Component
SMD
Electronic Component
±50ppm/℃
Resistor Type
Current Sense Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RLS12FTCR033 产品概述

一、产品简介

RLS12FTCR033 为大毅科技推出的一款高精度贴片电流采样电阻(分流器),阻值为 33 mΩ,额定功率 1 W,精度 ±1%,温度系数 (TCR) ±50 ppm/℃,常见封装为 1206(约 3.2 × 1.6 mm)。该器件适用于要求体积小、精度高、低温漂的电流检测场景,是开关电源、电池管理与电机驱动等系统中常用的电流采样元件。

二、主要参数

  • 电阻类型:采样电阻 / 分流器
  • 标称阻值:33 mΩ
  • 精度:±1%
  • 额定功率:1 W(在推荐散热和 PCB 布局下)
  • 温度系数:±50 ppm/℃
  • 安装方式:贴片(SMD)
  • 封装:1206(约 3.2 × 1.6 mm)
  • 品牌:大毅科技

三、性能特点

  • 高精度:±1% 初始精度,配合良好的测量电路可获得稳定的电流读数。
  • 低温漂:±50 ppm/℃ 的低 TCR 可显著降低温度变化对测量误差的影响(例如温度变化 50℃ 时阻值变化仅约 0.25%)。
  • 小体积:1206 封装适合密集布板和自动贴装流程。
  • 功率能力:额定 1 W,理论最大持续电流 Imax = sqrt(P/R) ≈ 5.5 A;建议按可靠性和散热考虑做适当降额(推荐连续工作电流 3–4 A 范围,脉冲电流可高于此值,需参考实际温升测试)。

四、典型应用场景

  • 开关电源与电源管理(电流限制、功率测量)
  • 锂电池管理系统(BMS)和便携式电源检测
  • 电机驱动与伺服控制的电流监控
  • 服务器与通信设备的电流采样与保护电路
  • LED 恒流控制与电流反馈回路

五、使用与选型建议

  • 电流计算:采用公式 P = I^2 × R 进行功耗计算,结合 PCB 散热条件确认是否需要降额。
  • 测量方式:低侧采样接地较为简单;高侧采样需选用支持高共模电压的差分放大器或专用电流检测放大器。
  • 放大与滤波:搭配精密差分放大器/仪表放大器并加合适滤波,能提升信号抗干扰能力与测量稳定性。
  • 精度控制:为了最大化精度,注意焊盘对称、避免不均匀焊膏以及减少额外电阻(引线和焊盘阻抗)对读数的影响。必要时采用四端(Kelvin)测量或在 PCB 布局上实现等效方案。

六、封装与安装注意事项

  • 尺寸与焊接:1206 封装占板面积小,推荐按厂商的推荐焊盘尺寸和回流曲线进行焊接,避免过高的回流温度或过长的焊接时间导致漂移。
  • 散热与铜箔:为保证长期稳定性,应在 PCB 上为采样电阻周围增大铜箔面积或使用散热过孔,利于热量扩散,降低温升。
  • 位置选择:尽量靠近被测电源路径布置,缩短信号走线,避免热源(功率器件)直接邻近造成温度梯度。

七、可靠性与测试建议

  • 温度漂移测试:在预计工作温度范围内进行阻值漂移测试,验证 ±50 ppm/℃ 的实际表现。
  • 长期功耗老化:在实际 PCB 环境下进行加速寿命测试,评估焊点与电阻元件的长期稳定性。
  • 抗热电势(Thermal EMF):在精密低电压测量场合注意热电势影响,布局和对称焊接有助于降低误差。

备注:以上为 RLS12FTCR033 的通用产品概述与工程应用建议。具体详细参数、封装尺寸公差、包装形式及环境认证等,请参阅大毅科技提供的正式数据手册与检验报告,或在设计前联系厂家获取最新技术支持。

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