WMSIC Electronic Components

TA-I Technology RLH12FTCR240

ModelRLH12FTCR240
Package1206
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RLH12FTCR240
Type
TA-I Technology
Minimum package
5000 圆盘

Technical parameters

Power
1W
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RLH12FTCR240
Electronic Component
1
Package
1206
Electronic Component
Current Sense Resistor / Shunt
Electronic Component
±1%
Electronic Component
0.035g
Electronic Component
240mΩ
Electronic Component
1
Electronic Component
BM0264899882
Electronic Component
SMD
Electronic Component
±100ppm/℃
Resistor Type
Current Sense Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RLH12FTCR240 产品概述

一、产品概要

RLH12FTCR240 是大毅科技面向电源管理与开关电源电流检测而设计的贴片型采样电阻。标称阻值 240 mΩ,精度 ±1%,额定功率 1W,温度系数 ±100 ppm/℃,1206 封装,采用高纯度氧化铝基板与大电极结构,兼具低阻值与高精度特性,满足严苛的电流检测要求并符合 RoHS 无铅要求。

二、主要特性

  • 低阻值、低功耗电压降,适合高电流检测场景;
  • 高精度 ±1%,保证测量线性与系统校准精度;
  • 温漂 ±100 ppm/℃,在宽温区间保持稳定读数;
  • 大电极与高导热基板,散热性能优异,利于高功率耗散;
  • 贴片 1206 封装,便于 SMT 工艺与批量生产。

三、电气与热性能

在常温下 240 mΩ 的阻值提供较小的功耗损耗,1W 的额定功率在良好散热条件下可稳定工作。±100 ppm/℃ 的 TCR 对于测量精度影响较小,有利于温度变化场景中维持测量一致性。建议在设计中考虑一定的热裕量与散热路径,以防长期过载导致漂移。

四、封装与安装建议

  • 使用标准 1206 PCB 焊盘,扩大铜箔面积以提升散热;
  • 采用四端或 Kelvin 测量方式可显著减少引线电阻影响,提升测量精度;
  • 推荐遵循焊接曲线的 SMT 回流规范,避免过高温度或长时间高温造成性能漂移;
  • 器件应避免反复机械应力与弯曲,存储时保持干燥、防潮。

五、典型应用

适用于开关电源、DC-DC 转换器、电池管理系统、过流检测与功率管理等需要高精度电流监测的场合,尤其在空间受限且需表面贴装的电路板设计中表现良好。

六、质量与合规

采用无铅制造工艺,符合 RoHS 要求。高纯氧化铝基板与大电极设计提升可靠性与热稳定性。建议在关键应用中进行寿命验证与热循环测试以确认长期稳定性。

七、选型要点与注意事项

选择时关注实际工作电流与系统允许的压降,确认板上散热面及环境温度可支撑 1W 功耗。若需更低温漂或更高功率,应考虑更大封装或金属壳型采样电阻。使用时优先采用 Kelvin 测量并在 PCB 布局侧重散热与低阻路径设计。

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