WMSIC Electronic Components

TA-I Technology RLH12FTCR600

ModelRLH12FTCR600
Package1206
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RLH12FTCR600
Type
TA-I Technology
Minimum package
5000 圆盘

Technical parameters

Power
1W
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RLH12FTCR600
Electronic Component
1
Package
1206
Electronic Component
Current Sense Resistor / Shunt
Electronic Component
±1%
Electronic Component
0.035g
Electronic Component
600mΩ
Electronic Component
1
Electronic Component
BM0264899889
Electronic Component
SMD
Electronic Component
±100ppm/℃
Resistor Type
Current Sense Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RLH12FTCR600合金采样电阻产品概述

一、产品定位与品牌背景

RLH12FTCR600是大毅科技推出的高性能合金贴片采样电阻,属于功率型电阻范畴,专为电子系统中精准电流检测设计。大毅科技作为国内专业电阻制造商,拥有成熟的合金电阻生产工艺,产品以精度稳定、可靠性高、抗环境干扰能力强著称,广泛覆盖工业、汽车电子、消费电子等领域。

二、核心技术参数深度解析

该电阻的核心参数精准匹配电流采样场景需求,具体如下:

  1. 阻值与精度:标称阻值为600mΩ(毫欧),精度±1%,可避免因阻值偏差导致的控制误差或保护误动作,满足中高端设备采样精度要求;
  2. 功率等级:额定功率1W,在1206小封装下实现高功率密度,可承受短时间脉冲电流冲击(典型过载能力为额定电流35倍,持续15秒);
  3. 温度系数(TCR):±100ppm/℃,即温度每变化1℃,阻值变化±100×10⁻⁶倍原阻值。以600mΩ为例,温度从-55℃升至125℃(变化180℃)时,阻值变化仅±10.8mΩ,宽温下采样一致性优异;
  4. 封装规格:1206贴片封装(英制3.2mm×1.6mm,公制3216),兼容常规SMT工艺,适合高密度PCB设计,节省电路空间。

三、封装与工艺特性

RLH12FTCR600的封装和工艺设计兼顾可靠性与易用性:

  • 合金电阻体:采用锰铜/镍铬合金材料(大毅专利工艺),相比碳膜、金属膜电阻,温度系数更低、热稳定性更强、抗浪涌能力突出;
  • 表面涂覆:电阻体涂覆耐高温绝缘漆,可承受无铅回流焊峰值温度(260℃以内),同时防潮气、灰尘侵蚀;
  • 端电极结构:三层复合设计(镍+铜+锡),与PCB焊接牢固,抗机械应力能力强,减少焊接开路风险。

四、性能优势对比

与同类普通电阻相比,该电阻核心优势显著:

对比维度 RLH12FTCR600 普通碳膜电阻 普通金属膜电阻 精度 ±1% ±5%~±10% ±2%~±5% TCR ±100ppm/℃ ±500ppm/℃以上 ±200ppm/℃以上 1W功率封装 1206 1812及以上 1206(精度低) 抗浪涌能力 强(合金体) 弱 中等

可见其在精度、功率密度、宽温稳定性上更适配电流采样场景。

五、典型应用场景

RLH12FTCR600的性能匹配多类电子系统需求,典型应用包括:

  1. 电池管理系统(BMS):电动车、储能电站的单体/模组电流采样,监控充放电电流,实现过流、过充保护;
  2. 开关电源:AC-DC适配器、DC-DC转换器的输出电流采样,用于恒流控制、过流保护(OCP);
  3. 电机驱动:BLDC无刷电机、伺服电机的电流反馈回路,优化转速与扭矩控制精度;
  4. 工业自动化:PLC、变频器的电流检测,保障设备稳定运行;
  5. 消费电子:笔记本电脑、手机充电器的过流保护电路,提升安全性能。

六、选型与使用注意事项

为保证性能稳定,使用时需注意:

  1. 功率降额:实际工作功率不超过额定功率80%(0.8W),避免长期过载导致阻值漂移;
  2. 焊接工艺:无铅回流焊峰值温度≤260℃,焊接时间≤10秒,避免高温损坏电阻体;
  3. 环境温度:工作范围-55℃~125℃,超出需进一步降额;
  4. 布线要求:采样线尽量短,避免与大电流线路并行,减少电磁干扰(EMI);
  5. 存储条件:常温干燥环境(0℃~40℃,湿度≤70%),开封后12个月内使用完毕。

总结

RLH12FTCR600是兼具高精度、高功率密度、宽温稳定性的合金采样电阻,完美适配各类电子系统电流检测需求。依托大毅科技成熟工艺,该电阻长期可靠性、抗干扰能力突出,是工业控制、汽车电子、消费电子等领域电流采样环节的优质选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.