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TA-I Technology RLP25FEEMR002
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RLP25FEEMR002
- Type
- TA-I Technology
- Minimum package
- 4000 圆盘
Technical parameters
- Power
- 2W
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- RLP25FEEMR002
- Electronic Component
- 1
- Package
- 2512
- Electronic Component
- Current Sense Resistor / Shunt
- Electronic Component
- ±1%
- Electronic Component
- 0.084g
- Electronic Component
- 2mΩ
- Electronic Component
- 1
- Electronic Component
- BM0264549185
- Electronic Component
- SMD
- Electronic Component
- ±50ppm/℃
- Resistor Type
- Current Sense Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RLP25FEEMR002 产品概述
一、产品简介
RLP25FEEMR002 是大毅科技推出的一款贴片电流采样电阻（分流器），阻值 2 mΩ，公差 ±1%，额定功率 2 W，温度系数（TCR）±50 ppm/℃，封装为常用的 2512（SMD）。该器件适合对中高电流进行精确采样与检测，具有低压降、低温漂和良好的功率承载能力。
二、主要性能特点
- 阻值：2.000 mΩ，精度 ±1%，适合精密电流测量场合。
- 额定功率：2 W（在合理散热条件下），适用较大电流持续采样。
- 温度系数：±50 ppm/℃，热稳定性好，有利于提高测量精度。
- 封装：2512 贴片，便于自动贴装和工业化产线使用。
- 材料与制造工艺保证低噪声、低热电势，满足长期稳定性要求。
三、典型应用
- 电池管理系统（BMS）电流监测
- DC-DC 转换器与电源模块电流采样
- 直流电机驱动与电流限流保护
- 服务器、电信和工业电源测量与保护电路
- 精密测试与测量设备中的电流传感
四、设计与布局建议
- 为保证散热与长期功率承载能力，建议在 PCB 底部设计大面积铜箔散热面并采用热过孔增强散热。
- 虽为两端贴片结构，测试与校准时建议采用四线（Kelvin）测量方法以消除引线与焊盘电阻影响。
- 注意功率热耗 P = I^2·R 的计算，例如允许持续功率 2 W 时，理论最大连续电流约为 31.6 A（受散热限制，应按实际 PCB 散热条件降低）。
- 推荐无铅回流焊兼容的焊接工艺与适当的焊盘尺寸，遵循厂商的焊接与保管建议以避免应力与热损伤。
五、可靠性与订购信息
- 采用工业级制造与检验流程，满足常见的环境与可靠性要求（如耐焊接、抗热循环）。
- 订购型号：RLP25FEEMR002，品牌：大毅科技，封装：2512。
- 在实际应用中，请结合具体电路散热条件与测量要求进行额定功率与温漂余量的验证测试，以确保长期稳定性。
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