WMSIC Electronic Components

TA-I Technology RLP25FEEMR005

ModelRLP25FEEMR005
Package2512
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RLP25FEEMR005
Type
TA-I Technology
Minimum package
4000 圆盘

Technical parameters

Power
2W
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RLP25FEEMR005
Electronic Component
1
Package
2512
Electronic Component
Current Sense Resistor / Shunt
Electronic Component
±1%
Electronic Component
0.084g
Electronic Component
5mΩ
Electronic Component
1
Electronic Component
BM0264549199
Electronic Component
SMD
Electronic Component
±50ppm/℃
Resistor Type
Current Sense Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RLP25FEEMR005 产品概述

一、产品简介

RLP25FEEMR005 是大毅科技推出的一款贴片电流采样电阻(分流器),阻值为 5 mΩ,精度 ±1%,功率等级 2W,温度系数(TCR)为 ±50 ppm/°C,采用 2512 封装。专为高电流、低压降的精确电流检测场合设计,适配自动贴片生产,便于在电源管理、BMS、直流-直流转换和电机驱动等系统中使用。

二、主要电气参数

  • 阻值:5 mΩ ±1%(0.005 Ω,精度等级高,利于精确测量)
  • 额定功率:2W(常温、良好散热条件下)
  • 温度系数:±50 ppm/°C(保证随温度变化的阻值稳定性)
  • 封装:2512(适配常用 SMT 贴装工艺) 由功率与阻值可推算理想连续电流:Imax = sqrt(P/R) ≈ 20A(实际使用建议考虑散热与降额)。

三、关键特性与优势

  • 高精度:±1% 阻值公差,适用于对测量精度要求高的采样电路。
  • 良好热性能:2W 功率与 2512 大封装有利于散热,适合中高电流场景。
  • 低 TCR:±50 ppm/°C 降低温度漂移,提升长期测量稳定性。
  • SMT 兼容:2512 封装支持自动化贴装与回流焊,便于量产。

四、典型应用场景

  • 电池管理系统(BMS)电流检测与保护
  • 开关电源与低压大电流 DC-DC 采样
  • 电机驱动电流监测与过流保护
  • 成本与尺寸受限的电流测量模块

五、选型与布局建议

  • 散热考虑:在高电流或高环境温度下,应在电阻下方或两侧布置铜域以增强散热;必要时增加散热铜柱或放大焊盘面积。
  • 测量精度:建议使用四端(开尔文)测量法或在 PCB 上预留独立的感测引线,尽量避免测量回路与主电流回路共用长走线。
  • 降额使用:实际连续电流建议根据 PCB 散热条件和环境温度适当降额,一般在高温或散热受限时将允许电流显著降低。
  • 焊接工艺:按常规无铅回流曲线进行焊接,避免过热导致阻值漂移或机械应力。

六、可靠性与测试

  • 建议在设计验证阶段进行长期温漂测试与热冲击测试,校核在实际工作温度下的阻值漂移。
  • 对于高精度应用,出厂后应进行批次抽检与完整性验证(阻值、功率承受、焊接可靠性)。

七、包装与订购信息

  • 型号:RLP25FEEMR005
  • 品牌:大毅科技
  • 封装:2512,贴片,常见卷盘(Tape & Reel)包装,便于 SMT 贴装与自动化生产。

总结:RLP25FEEMR005 是一款面向中高电流、要求高精度和良好温度稳定性的采样电阻器件。合理的 PCB 布局与散热设计能充分发挥其性能,适合电源管理、电池管理及工业控制等多种场景。若需进一步的封装图、热阻或完整规格书,建议向大毅科技索取官方 datasheet 以供精确设计。

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