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TA-I Technology RMS04FT1212
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RMS04FT1212
- Type
- TA-I Technology
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- RMS04FT1212
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.009g
- Electronic Component
- 12.1kΩ
- Electronic Component
- 10
- Electronic Component
- BM0264800768
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RMS04FT1212 厚膜贴片电阻产品概述
一、产品核心定位
RMS04FT1212是大毅科技推出的0402封装厚膜贴片电阻，针对小体积高密度PCB、低功耗精密电路场景设计，兼顾精度、稳定性与成本优势，可覆盖工业级、消费电子及通信设备等多领域的基础电阻需求，是信号分压、限流、滤波等电路的核心被动元件之一。
二、关键参数深度解析
该电阻的核心参数匹配多场景应用需求，具体如下：
- 阻值与精度：固定阻值12.1kΩ，精度±1%——满足传感器信号放大、ADC基准分压等精密电路的误差要求，避免阻值偏差导致的性能波动；
- 功率与电压：额定功率62.5mW，工作电压50V——低功耗适配便携设备（可穿戴、智能手机）的续航需求，50V额定电压覆盖常规低压信号电路（≤30V场景可安全降额）；
- 温度特性：温度系数±100ppm/℃，工作温度-55℃~+155℃——宽温范围适配工业现场（户外控制器、车载辅助系统）的极端环境，125℃时阻值偏差≤0.121%；
- 封装规格：0402封装（英制0.04×0.02英寸/公制1.0×0.5mm）——体积小、占位少，支持高密度PCB设计，兼容主流SMT自动贴装线。
三、工艺与封装特性
- 厚膜工艺优势：采用厚膜丝网印刷技术，相比薄膜电阻成本可控、抗硫化性能好；厚膜层附着力强，耐机械冲击与湿热环境，长期稳定性佳；
- 贴片封装设计：双侧端电极采用镍/锡无铅镀层（符合RoHS标准），与PCB焊盘兼容性好，焊接后机械强度可靠，支持回流焊、波峰焊工艺。
四、典型应用场景
结合参数特性，主要应用于：
- 消费电子：智能手机电源管理（限流）、可穿戴设备信号调理（分压）；
- 工业控制：PLC模块传感器信号采集（偏置电阻）、户外监控设备滤波；
- 通信设备：路由器阻抗匹配、光模块辅助偏置电路；
- 汽车电子：车载仪表盘背光、胎压监测信号处理（需确认AEC-Q200认证，大毅部分产品满足）；
- 医疗电子：血糖仪、血压计信号放大（低功耗稳定要求）。
五、可靠性与品质保障
- 宽温可靠性：经-55℃~+155℃循环1000次测试，阻值变化≤0.5%，满足工业级环境要求；
- 抗环境性能：85℃/85%RH环境1000小时阻值变化≤1%，抗硫化符合JESD22-A101标准；
- 品牌背书：大毅科技作为台湾老牌被动元件厂商，批量生产阻值一致性控制在±0.5%以内，提供完整技术文档与售后支持。
六、应用注意事项
- 功率降额：实际应用建议降额至50%以下（≤31.25mW），延长寿命；
- 焊接工艺：回流焊峰值温度≤245℃，遵循IPC-A-610标准；
- 存储条件：未开封产品存于25℃±5℃、湿度≤60%环境，开封后12个月内使用完毕。
该产品通过平衡小体积、精度与可靠性，成为多领域电路设计的实用选择。
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