Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TA-I Technology RLH25FEER600
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RLH25FEER600
- Type
- TA-I Technology
- Minimum package
- 4000 圆盘
Technical parameters
- Power
- 2W
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- RLH25FEER600
- Electronic Component
- 1
- Package
- 2512
- Electronic Component
- Current Sense Resistor / Shunt
- Electronic Component
- ±1%
- Electronic Component
- 0.065g
- Electronic Component
- 600mΩ
- Electronic Component
- 1
- Electronic Component
- BM0264899887
- Electronic Component
- SMD
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Current Sense Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
大毅科技RLH25FEER600 2512封装采样电阻产品概述
一、产品定位与核心属性
RLH25FEER600是大毅科技推出的贴片式功率采样电阻，专为中低功率电路的电流检测、反馈与保护场景设计。该型号属于大毅RLH系列功率电阻，以2512封装为载体，核心阻值600mΩ（0.6Ω），兼顾精度、功率与成本，是工业控制、电源系统等领域的常规选型器件。
二、关键电气参数详解
- 阻值与精度：额定阻值600mΩ，精度±1%，满足工业级电流采样的中等精度需求，可有效减少采样误差对电路控制的影响；
- 功率能力：25℃环境下额定功率2W，是2512封装贴片电阻的典型功率规格，支持中功率电路的持续电流采样；
- 温度系数（TCR）：±100ppm/℃，即温度每变化1℃，阻值变化±0.01%，在常规工作温度范围内保持稳定性，适配宽温环境；
- 电流承载：根据功率公式(I=\sqrt{P/R})，25℃下最大承载电流约1.83A（实际应用需结合降额要求）。
三、封装与安装特性
- 封装规格：采用2512英制贴片封装，公制尺寸约6.4mm×3.2mm，厚度约0.5mm（典型值），占用PCB面积小，适合高密度电路设计；
- 安装方式：表面贴装技术（SMT），兼容常规回流焊、波峰焊工艺，无引脚设计可降低寄生电感与电容，提升高频电路的采样响应速度；
- 焊盘兼容性：两端电极采用耐高温焊料，适配0.8mm~1.2mm间距的PCB焊盘，贴装良率高。
四、典型应用场景
RLH25FEER600的参数特性使其适配以下场景：
- 电源系统：开关电源、DC-DC转换器的输出电流采样，过流保护电路的触发检测；
- 工业控制：小型电机驱动、变频器的电流反馈，伺服系统的电流闭环控制；
- 消费电子：65W以上大功率充电器、移动电源的充放电电流监测，电池管理系统（BMS）的电流检测；
- 车载辅助电路：车载充电器、LED驱动电源的电流采样（需结合具体环境认证要求）。
五、可靠性与环境适应性
- 工艺稳定性：采用合金箔电阻技术（大毅典型工艺），阻值稳定性优于金属膜电阻，抗老化性能良好；
- 温度范围：工作温度-55℃155℃，存储温度-55℃175℃，满足工业级宽温需求；
- 降额要求：100℃时额定功率降额至约1.2W，125℃时降额至约1W，155℃时降额至约0.5W，需根据实际工作温度调整使用功率；
- 抗干扰性：贴片封装无引脚寄生参数，配合低阻值特性，可有效减少电磁干扰（EMI）对采样信号的影响。
六、选型参考建议
- 电流范围匹配：适合采样电流1A~1.5A（考虑降额）的电路，若电流更大需选择更高功率或更低阻值型号；
- 精度平衡：±1%精度+±100ppm/℃，适合对精度要求不极端（如±0.1%）但需稳定的场景，成本优于高精度型号；
- 品牌与成本：大毅科技作为国内知名被动元件厂商，产品性价比高于进口品牌同类产品，适合批量应用。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
