WMSIC Electronic Components

TA-I Technology RLP25FEGR025

ModelRLP25FEGR025
Package2512
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RLP25FEGR025
Type
TA-I Technology
Minimum package
4000 圆盘

Technical parameters

Power
3W
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RLP25FEGR025
Electronic Component
1
Package
2512
Electronic Component
Current Sense Resistor / Shunt
Electronic Component
±1%
Electronic Component
0.072g
Electronic Component
25mΩ
Electronic Component
1
Electronic Component
BM0264549160
Electronic Component
SMD
Electronic Component
±50ppm/℃
Resistor Type
Current Sense Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

大毅科技RLP25FEGR025 电流采样电阻产品概述

一、产品定位与核心应用场景

大毅科技RLP25FEGR025是一款低阻值高精度贴片分流电阻,专为电流采样设计,核心作用是将电路中的大电流转换为可测量的低电压信号(通过公式(I=\frac{V}{R})),为控制系统提供准确的电流反馈,实现过流保护、恒流控制、功率监控等功能。产品覆盖电力电子、工业自动化、新能源等领域,是中等功率电流采样场景的经典选型。

二、关键参数与性能优势

RLP25FEGR025的核心性能集中在「低阻值+高精度+大功率密度」,具体参数如下:

参数维度 具体指标 性能解读 阻值与精度 25mΩ ±1% 毫欧级低阻值降低自身功耗((P=I^2R)),±1%精度满足工业级基本采样需求,无需额外校准 额定功率 3W 搭配2512封装实现高功率密度(≈14.7W/cm²),适配紧凑PCB布局 温度系数(TCR) ±50ppm/℃ 温度变化对阻值影响极小:25℃→100℃时,阻值仅变化0.09375mΩ,远低于精度范围 材料特性 合金电阻(镍铬/锰铜) 低电感、低寄生电容,避免高频信号失真,适合开关电源、变频器等场景

三、封装与安装特性

产品采用2512标准表面贴装封装,适配现代电子生产工艺:

  1. 封装尺寸:约6.4mm(长)×3.2mm(宽)×0.5mm(厚),重量轻(≈0.1g),兼容常规PCB焊盘;
  2. 安装兼容性:支持回流焊、波峰焊自动化生产,手工焊接需控制温度(≤260℃/10s);
  3. 环保合规:符合RoHS 2.0、REACH标准,无铅无卤工艺,可用于出口产品或高端设备。

四、可靠性与环境适应性

作为工业级电阻,RLP25FEGR025具备宽温域与抗恶劣环境能力:

  • 工作温度:-55℃~155℃(覆盖工业极端环境,如户外储能、高温车间);
  • 长期稳定性:1000小时高温老化后阻值漂移≤0.1%,振动测试(10Hz~2000Hz/2g)无性能衰减;
  • 耐候性:抗腐蚀涂层通过盐雾测试(IEC 60068-2-11),可抵抗潮湿、盐雾侵蚀。

五、典型应用方向

产品适配多领域电流采样需求,典型场景包括:

  1. 新能源:新能源汽车BMS(充放电电流检测)、光伏逆变器(MPPT电流监控);
  2. 工业控制:变频器/伺服驱动器(电机电流控制)、PLC(现场电流采集);
  3. 消费电子:大功率快充充电器(过流保护)、LED驱动电源(电流稳定控制)。

六、选型参考要点

选择时需注意以下匹配性:

  1. 电流范围:最大允许电流≈11A(降额50%后建议≤6A),超量程需选更高功率型号;
  2. 精度需求:若需±0.5%/±0.1%精度,需确认对应等级产品;
  3. 环境匹配:超155℃需咨询高温版本,强振动/盐雾需验证测试标准;
  4. 空间适配:空间紧张可考虑小封装(如1206),但需确认功率是否满足。

总结

RLP25FEGR025凭借低阻值、高精度与可靠的环境适应性,成为电力电子、新能源等领域的常用选型,可满足大多数中等功率电流采样的需求,是平衡性能与成本的优质方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.