Model & package intelligence
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TA-I Technology RLP25JEER010
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RLP25JEER010
- Type
- TA-I Technology
- Minimum package
- 4000 圆盘
Technical parameters
- Power
- 2W
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- RLP25JEER010
- Electronic Component
- 1
- Package
- 2512
- Electronic Component
- Current Sense Resistor / Shunt
- Electronic Component
- ±5%
- Electronic Component
- 0.084g
- Electronic Component
- 10mΩ
- Electronic Component
- 1
- Electronic Component
- BM0264549170
- Electronic Component
- SMD
- Electronic Component
- ±50ppm/℃
- Resistor Type
- Current Sense Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RLP25JEER010 产品概述
一、产品简介
RLP25JEER010 为大毅科技出品的贴片型电流采样电阻（分流器），阻值 10 mΩ，标称功率 2W，阻值公差 ±5%，温度系数 ±50 ppm/℃，封装尺寸 2512。该器件以低阻值、较高功率密度和良好温度稳定性为特点，适用于中小电流测量与保护场合的电流取样。
二、主要性能参数
- 阻值（R）：0.010 Ω ±5%
- 功率等级：2 W（器件自带额定条件下）
- 温度系数（TCR）：±50 ppm/℃（极佳的温度相关漂移控制）
- 封装：2512 贴片，便于自动贴装与回流焊工艺
- 安装方式：SMD
三、电气与热性能要点
- 额定连续电流估算：Imax ≈ sqrt(P/R) = sqrt(2 / 0.01) ≈ 14.14 A（理论值，实际应按 PCB 散热条件与厂家降额曲线评估）。
- 典型电压降举例：在 10 A 时电压降约 100 mV；在 5 A 时功耗约 0.25 W。
- TCR ±50 ppm/℃ 表示每升高 1℃ 阻值变化约 0.005%，在宽温度范围下能保持较好的线性与稳定性。
四、PCB 设计与安装注意事项
- 为保证散热与额定功率输出，建议在焊盘周围设计足够的铜箔面积作为散热片，并考虑通过多层铜层过孔改善热传导。
- 贴片为两端接触式结构，若需高精度测量，推荐采用差分放大器或外部电流检测放大器，并尽量缩短电流回路与测量引线，避免共模干扰。
- 遵循厂家推荐回流焊温度曲线进行焊接，避免超温或过长时间的热暴露引起性能漂移。
五、应用场景
适合电池管理（BMS）、开关电源与电源管理、逆变器/电机驱动电流检测、服务器与通信设备功率监控、过流保护与能耗计量等需要中等精度电流取样的场合。
六、选型与使用建议
- 若系统对采样精度要求高于 ±5%，建议选用更高精度电阻或通过软件/硬件校准补偿温漂与初始误差。
- 在脉冲或短时过流场合，可允许短时间超过额定电流，但必须根据脉冲宽度与热阻评估温升并确认不会损坏器件。
- 设计时参照厂方热阻与功率降额曲线进行安全裕量设计，确保长期可靠性。
综上，RLP25JEER010 以 10 mΩ / 2W / ±50 ppm/℃ 的性能组合，为要求中等精度、需兼顾功率与温漂特性的电流采样应用提供了稳健可靠的选择。若需更详细的温升曲线、封装尺寸与焊盘建议图，可向大毅科技索取 Datasheet。
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