Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TA-I Technology RLM12FTCMR030
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RLM12FTCMR030
- Type
- TA-I Technology
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 1W
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- RLM12FTCMR030
- Electronic Component
- 1
- Package
- 1206
- Electronic Component
- Current Sense Resistor / Shunt
- Electronic Component
- ±1%
- Electronic Component
- 0.03g
- Electronic Component
- 30mΩ
- Electronic Component
- 1
- Electronic Component
- BM0264549195
- Electronic Component
- SMD
- Resistor Type
- Current Sense Resistor
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RLM12FTCMR030 产品概述
一、产品简介
RLM12FTCMR030 是大毅科技推出的一款贴片电流采样电阻（分流器），阻值 30 mΩ，标称精度 ±1%，额定功率 1W，采用常见 1206（3216）封装。该器件专为精确电流检测设计，适合在受限空间内实现高精度电流采样与功耗测量，是电源管理、车载电子、锂电池管理和电机驱动等场景中常用的被动器件。
二、主要特性
- 阻值：30 mΩ，适用于小阻值电流采样需求
- 精度：±1% 满足中高精度测量要求
- 功率：1W（器件额定功率，使用时需考虑降额）
- 封装：1206 表面贴装，兼容自动贴片与回流焊工艺
- 结构：低阻抗、低热噪声、适合高电流短时测量
- 可重复焊接，符合工业制造良率要求
三、典型应用
- 开关电源（SMPS）电流检测与限流
- 电池管理系统（BMS）电池充放电监测
- 电机驱动与逆变器电流采样
- 电流计量与能耗统计模块
- 过流保护、功率测量与控制回路
四、典型电路与使用要点
- 采样方式：常见做法是将 RLM12FTCMR030 串联在电源回路或负载回路中，通过差分放大器（或运放构成的电流检测放大器）测量两端压降，从而计算电流。
- 放大与滤波：建议在采样端增加差分放大和 RC 低通滤波以抑制开关噪声，避免直接将高频噪声引入 ADC。
- 接地与摆放：若用于高侧检测，应配合高侧差分放大器；用于低侧检测，注意避免回流电流路径产生测量误差。
- 校准：为保证系统精度，建议在生产测试时对实际电阻值进行测量并写入校准系数。
五、封装与热管理建议
- 1206 封装体积小，但热阻相对较高，1W 功率在 PCB 上会产生显著热量。建议在器件底部与两侧铺设较宽的铜箔，并使用热铜基板或加大铜埋孔/过孔以提高散热能力。
- 在高环境温度下应按实际热环境对额定功率进行降额使用，避免长期在额定功率附近运行。
- 布线时尽量缩短电流回路，引出端使用足够宽的走线以降低串联阻抗与局部发热。
六、可靠性与测试
RLM12FTCMR030 适用于工业级使用场景，出厂通常经过阻值筛选与焊接可靠性测试。建议在设计验证阶段进行温度循环、长时功率老化及焊接热冲击测试，以确认在目标应用中的长期稳定性。
七、采购与型号说明
型号：RLM12FTCMR030
品牌：大毅科技
封装：1206（表面贴装）
参数：30 mΩ ±1% 1W
如需批量采购、样品或更多电气与热特性曲线（如温度系数、功率-温度降额曲线、频率响应等），请联系大毅科技技术支持或其授权分销商获取完整技术资料与应用参考。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
