WMSIC Electronic Components

TA-I Technology RLM12FTCMR008

ModelRLM12FTCMR008
Package1206
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RLM12FTCMR008
Type
TA-I Technology
Minimum package
5000 圆盘

Technical parameters

Power
1W
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RLM12FTCMR008
Electronic Component
1
Package
1206
Electronic Component
Current Sense Resistor / Shunt
Electronic Component
±1%
Electronic Component
0.03g
Electronic Component
8mΩ
Electronic Component
1
Electronic Component
BM0264549215
Electronic Component
SMD
Resistor Type
Current Sense Resistor
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RLM12FTCMR008 产品概述

一、产品简介

RLM12FTCMR008 是大毅科技推出的一款高精度贴片型电流采样电阻(分流器),阻值 8 mΩ,精度 ±1%,额定功率 1 W,标准 1206 封装。专为电流检测与能量管理场景设计,适配电源管理、充电器、逆变器及电池监测等应用。

二、主要参数

  • 型号:RLM12FTCMR008
  • 品牌:大毅科技
  • 阻值:8 mΩ
  • 精度:±1%
  • 额定功率:1 W(器件自身标称)
  • 封装:1206(约 3.2 mm × 1.6 mm)
  • 安装方式:贴片(SMD)

三、产品特点

  • 高精度:±1% 标准,适合对电流测量精度要求较高的场合。
  • 低阻值:8 mΩ 可在较小的压降下测量较大电流,降低系统功耗。
  • 良好功率密度:1 W 额定功率,配合合理 PCB 散热可支持较大连续电流。
  • SMD 形式:兼容自动化贴装,利于批量生产与可靠性控制。

四、电气与热性能说明

  • 最大理论连续电流 Imax = sqrt(P/R) ≈ sqrt(1 / 0.008) ≈ 11.2 A(理论值)。实际可用电流受 PCB 散热条件、环境温度与焊盘面积影响,建议根据具体 PCB 布局进行热仿真或实测并适当降额。
  • 典型压降举例:1 A → 8 mV,5 A → 40 mV,10 A → 80 mV。配合差分放大器或高精度 ADC 前端使用,可实现高分辨率电流采样。

五、封装与安装建议

  • 尺寸:标准 1206,便于 SMT 贴装与回流焊工艺兼容。推荐采用卷带(Tape & Reel)供料以提高贴装稳定性。
  • 焊接:支持常规无铅回流焊,建议遵循焊膏厚度与回流曲线规范,避免器件发生过热或应力。
  • PCB 布局:为降低结温并提高测量稳定性,建议扩大焊盘铜面积,与器件两端采用对称加铜并引出至大面积接地或散热层;尽量缩短电流通路,减小寄生阻抗和电感。

六、设计与测量注意事项

  • 接线与测量:RLM12FTCMR008 为两端式分流器,如需更高精度的四端测量,应在 PCB 上设计独立的电流端和电压采样端(Kelvin 布局)以减少接触与焊点影响。
  • 共模电压与放大器选择:选择差分放大器或霍尔采样前端时注意放大器的输入失调、电压范围与共模耐受值,确保信号采样精度。
  • 温漂与稳定性:尽管本品具备良好稳定性,长时间运行时仍需关注温升导致的阻值漂移,关键设计应考虑温度系数与热路径控制。

七、典型应用

  • 电源管理与负载监测
  • 电池组电流检测与保护
  • 充电器与适配器电流采样
  • 电机驱动与逆变器电流反馈

八、可靠性与品质保证

大毅科技对该系列产品进行品质控制与可靠性测试,常规提供批量一致性与可追溯性。对于需高可靠性或特殊环境(高温、振动、长寿命)使用场景,建议与供应商确认更详尽的热循环、寿命与机械强度测试数据。

如果需要样品规格书、封装图或在特定 PCB 布局下的实际功率与温升测试建议,可提供电路条件,我可帮助估算并给出更具体的布局与降额建议。

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