Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TA-I Technology CFS12V6T2R0
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CFS12V6T2R0
- Type
- TA-I Technology
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- CFS12V6T2R0
- Electronic Component
- 1
- Electronic Component
- 1.6mm
- Package
- 1206
- Type
- SMD Fuse
- Electronic Component
- Non-Resettable Fuse
- Electronic Component
- 0.03g
- Electronic Component
- 3.2mm
- Electronic Component
- 0.6mm
- I2t
- 0.339
- Electronic Component
- 1
- Electronic Component
- 50A
- Electronic Component
- BM0264899877
- Operating Temperature
- 20℃~+105℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CFS12V6T2R0 1206贴片式保险丝产品概述
一、产品概述
CFS12V6T2R0为大毅科技推出的1206封装贴片式熔断器，尺寸为3.2mm × 1.6mm × 0.6mm（1206）。该器件额定电流2A，额定电压63V，工作温度范围为-20℃至+105℃，采用纸带包装，便于SMT贴装与自动化生产。凭借紧凑的体积与可靠的分断能力，适用于对空间和可靠性有要求的电子产品电路保护。
二、主要参数与性能
- 类型：贴片式保险丝（SMD fuse）
- 额定电流：2A
- 额定电压：63V
- 工作温度：-20℃ ~ +105℃
- 熔断能量（I2t）：0.339 A²s（能量让渡较低，有利于限制故障能量）
- 分断能力：50A（能在故障时安全中断高达50A的电流）
- 外形尺寸：3.2 × 1.6 × 0.6 mm（1206）
- 包装方式：纸带包装（适配自动贴片机）
三、产品特点
- 小型化封装，节省PCB空间，适合高密度布局。
- 较低的I2t值，能在短时过流时快速响应，减小下游器件受损风险。
- 分断能力高达50A，可应对较大故障电流，增强系统安全性。
- 宽温度适应范围，适用于多数工业与消费类环境。
- 纸带包装，便于高速SMT贴装与自动化流水线生产。
四、典型应用场景
- 移动设备和便携式电源的过流保护（电池管理与充电线路）。
- 开关电源、适配器与LED驱动器的输入侧保护。
- 工业控制与通信设备、仪器仪表中对电源短路的保护。
- 汽车电子低压电路（留意汽车行业特殊认证需求）。
五、选型与使用注意事项
- 依据工作电流选择合适的熔断额定值，建议在正常工作电流留有适当余量（常见留余10%~50%，视系统特性而定）。
- 考虑环境温度对熔断性能的影响，高温环境可能降低允许电流，应参考厂商温升曲线或 derating 数据。
- 对有大电感或强浪涌的负载，应评估是否需要配合限流元件或选择具有更高I2t能力的保护元件。
- 推荐使用标准回流焊工艺，避免超过器件耐温极限；贴装前后注意防潮、防污染。
- 对于需要认证（如汽车AEC-Q）的应用，请确认器件认证状态与可靠性试验记录。
六、包装与可靠性
CFS12V6T2R0采用纸带包装，适配常见SMT贴片机，提高贴装效率。大毅科技在生产中注重品质控制，器件经过熔断特性、耐温循环与分断能力测试，适合量产与长期使用。选购时建议索取数据手册与可靠性报告以满足特定应用的验证需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
