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TA-I Technology RLH25FEER270
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RLH25FEER270
- Type
- TA-I Technology
- Minimum package
- 4000 圆盘
Technical parameters
- Power
- 2W
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- RLH25FEER270
- Electronic Component
- 1
- Package
- 2512
- Electronic Component
- Current Sense Resistor / Shunt
- Electronic Component
- ±1%
- Electronic Component
- 0.084g
- Electronic Component
- 270mΩ
- Electronic Component
- 1
- Electronic Component
- BM0264800755
- Electronic Component
- SMD
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Current Sense Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RLH25FEER270 产品概述
一、产品简介
RLH25FEER270 是大毅科技推出的一款贴片式电流采样电阻（分流器），阻值为 270 mΩ，额定功率 2W，精度 ±1%，温度系数（TCR）±100 ppm/℃，封装为 2512（SMD）。该型号适用于以电阻压降法采样电流、过流检测与能量管理等电路场合，兼顾高功率密度与良好稳定性。
二、主要电性能参数
- 阻值：270 mΩ ±1%（公差对应绝对误差约 ±2.7 mΩ）
- 额定功率：2W（在规定散热条件下）
- 温度系数：±100 ppm/℃（即约 ±0.01%/℃，对应约 27 µΩ/℃）
- 封装：2512（标准尺寸约 6.35 mm × 3.2 mm）
基于额定功率和阻值，可得最大连续电流约 Imax = sqrt(P/R) ≈ 2.72 A，对应最大压降 V = I·R ≈ 0.74 V（在功耗接近 2W 时）。
三、热管理与功率降额
该器件为表面贴装高功率电阻，实际可承受功率受环境温度、PCB 散热铜箔面积及通风条件影响显著。建议在近额定功率工作时采取足够的散热措施（加大铜箔、使用多层过孔导热、避开热源）；长期或高环境温度下应按厂商 datasheet 的热降额曲线进行功率降额设计，以保证可靠性与漂移性能。
四、封装与布板建议
- 采用 2512 标准焊盘，保证焊点宽度与焊锡覆盖以提高热传导。
- 如需高精度电流测量，推荐在采样点两侧尽量减小串联阻抗，并将差分放大器输入靠近分流电阻，缩短寄生引线。2512 为两端端子结构，若需要四端接线精度，应考虑专用四端电阻或外部 Kelvin 结构。
- 回流焊工艺应遵循 IPC/JEDEC 推荐曲线，避免过高峰值温度和反复加热导致性能变化。焊接后建议进行阻值测量以确认焊接影响。
五、典型应用
适用于电源管理与保护、DC-DC/AC-DC 电源的电流监测、UPS 与电池管理系统（BMS）、电机驱动与充电桩、LED 驱动电路以及各种需要低阻值、高功率电流采样的工业电子应用。
六、可靠性与选型注意
选择时需关注工作温度范围、长期热循环与功率循环的可靠性数据；若系统对测量精度要求高，考虑更低 TCR 或更高精度（±0.5%、±0.1%）的器件。订购时请以完整料号（RLH25FEER270）与大毅科技正式 datasheet 为准，确认包装（卷带、盒装）、出厂检验与可追溯性要求。
如需进一步的电热仿真建议、PCB 散热设计实例或替代产品对比，可提供具体应用场景与电路参数以便给出更精细的方案。
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