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TA-I Technology RLP25FEER060
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RLP25FEER060
- Type
- TA-I Technology
- Minimum package
- 4000 圆盘
Technical parameters
- Power
- 2W
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- RLP25FEER060
- Electronic Component
- 1
- Package
- 2512
- Electronic Component
- Current Sense Resistor / Shunt
- Electronic Component
- ±1%
- Electronic Component
- 0.084g
- Electronic Component
- 60mΩ
- Electronic Component
- 1
- Electronic Component
- BM0264549192
- Electronic Component
- SMD
- Electronic Component
- ±50ppm/℃
- Resistor Type
- Current Sense Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RLP25FEER060 — 60mΩ 2W 采样电阻（2512）产品概述
一、产品简介
RLP25FEER060 为大毅科技推出的一款高可靠性贴片电流采样电阻（分流器），阻值 60mΩ，额定功率 2W，精度 ±1%，温度系数 ±50ppm/℃，封装为通用的 2512（6.35×3.2mm）尺寸。该器件专为电流检测与功率管理场合设计，适用于中等电流范围的精确电流采样与过流保护检测。
二、主要性能特点
- 低阻值、低压降：60mΩ 在测量电压降与功耗之间取得平衡，适合 1A–6A 级别的电流检测应用。
- 高精度：±1% 初始精度保证测量精度，配合合适的校准可用于闭环控制。
- 优良温漂：±50ppm/℃ 的温度系数可将温度引起的误差降到较低水平，有利于长期稳定测量。
- SMD 2512 封装：便于自动贴装和大规模生产，机械强度高、焊接可靠。
三、电气与热性能说明
- 额定功率 2W（在规定散热条件下）。需按照实际安装环境进行功率热降额计算。
- 示例计算：电流为 5A 时，功耗 P=I^2R=25×0.06=1.5W，压降 V=I×R=0.3V；接近功率极限时应考虑散热措施。
- 温度系数 ±50ppm/℃ 表示环境温度每变动 1℃，阻值理论变化约 0.003%（60mΩ 对应 ~0.00003Ω），整体影响小但在精密测量时仍需校正。
四、典型应用场景
- 电池管理系统（BMS）与充放电电流测量
- 开关电源与 DC-DC 转换器的电流检测与过流保护
- 电机驱动与伺服控制中的电流反馈
- 服务器、电信设备与工业电源的功率监测
五、布局与安装建议
- 推荐在 PCB 上为分流电阻提供较大铜箔散热区（PWR plane）及必要的过孔，降低结温并扩散热量。
- 布线时尽量将采样测量引线做短且对称，避免引入额外电阻或电感。
- 对于精密测量需求，若需更高精度可选用四端（Kelvin）测量方案；本器件为两端型，测量时注意并联焊盘阻抗影响。
- 遵循常规波峰/回流焊工艺，参考供应商的焊接温度曲线与湿敏等级（MSL）建议。
六、选型与注意事项
- 按照 I^2R 计算功耗并预留安全余量，长期运行建议在额定功率下留有 20–30% 的余量以延长寿命。
- 若系统允许较高压降，可选择更高阻值以提高测量灵敏度；若要求更小压降，则选择更低阻值且功率更高的分流器。
- 环境温度、频繁的热循环及冲击会影响长期稳定性，设计时考虑温升与散热路径。
七、可靠性与储存
- 本产品适用于工业级工作环境，良好的热管理和正确的焊接工艺可保证长期可靠性。
- 未使用前按正常电子元器件存储条件保存，避免潮湿和高温，开封后若有湿敏标签请按照 MSL 要求回流焊接。
RLP25FEER060 以其低阻值、良好温漂与较高功率密度，适合多数中功率电流监测场景。选型时请结合实际电流、压降预算与散热条件综合评估，必要时与供应商确认更详细的热阻与寿命数据。
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