WMSIC Electronic Components

TA-I Technology RLP25FEER400

ModelRLP25FEER400
Package2512
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RLP25FEER400
Type
TA-I Technology
Minimum package
4000 圆盘

Technical parameters

Power
2W
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RLP25FEER400
Electronic Component
1
Package
2512
Electronic Component
Current Sense Resistor / Shunt
Electronic Component
±1%
Electronic Component
0.072g
Electronic Component
400mΩ
Electronic Component
1
Electronic Component
BM0264549168
Electronic Component
SMD
Electronic Component
±50ppm/℃
Resistor Type
Current Sense Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

大毅科技RLP25FEER400 电流采样电阻产品概述

大毅科技推出的RLP25FEER400是一款专为中等功率大电流精准检测设计的贴片式合金电流采样电阻,属于功率型分流器范畴。该产品凭借高功率密度、低阻值精度稳定等特性,广泛适配工业、新能源、消费电子等领域的电流闭环控制与过流保护场景。

一、产品核心定位与应用方向

RLP25FEER400聚焦“高功率密度+稳定精度”的采样需求,解决传统电阻功率不足、温度漂移大的痛点,核心应用覆盖三大领域:

  1. 工业级设备:开关电源输出电流检测、UPS充放电监控、光伏逆变器并网电流采样;
  2. 新能源应用:低速电动车电机驱动电流闭环、小型储能电池组BMS过流保护;
  3. 消费电子:65W+快充适配器输出电流控制、高功率游戏本电池充放电监测。

二、关键参数与性能优势

该产品的核心参数直接支撑其应用价值,具体如下:

参数项 规格值 性能意义 阻值 400mΩ(±1%精度) 低阻适配大电流,满足工业级精度 额定功率 2W(25℃环境) 功率密度高于普通贴片电阻30%以上 温度系数(TCR) ±50ppm/℃ 100℃温差下阻值漂移≤0.375% 封装 2512(SMD) 尺寸6.4×3.2mm,适配自动化贴装 耐温范围 -55℃~125℃ 宽温适应工业/户外环境

核心优势:

  • 大电流承载:额定功率下最大电流≈70.7A(I=√(P/R)),满足多数中等功率设备需求;
  • 精度稳定:低TCR设计减少温度波动影响,适合连续工作场景;
  • 高可靠性:锰铜合金材质抗氧化,贴片封装抗振动冲击,1000小时负载寿命下阻值变化≤0.5%。

三、封装与可靠性设计细节

RLP25FEER400采用2512标准贴片封装,兼顾生产效率与环境适应性:

  1. 焊接兼容性:支持回流焊、波峰焊,焊接温度曲线符合IPC J-STD-020(峰值245℃±5℃,时间≤10秒),避免热损伤;
  2. 抗环境干扰:表面涂覆抗氧化涂层,耐潮湿、盐雾(符合IEC 60068-2-11),适合户外/工业潮湿环境;
  3. 机械可靠性:引脚符合SMD规范,抗振动(10~2000Hz,1g加速度)与冲击(1000m/s²,1ms持续),满足车载/工业设备要求。

四、典型应用场景深度解析

1. 工业开关电源电流检测

开关电源输出电流需精准控制以保护负载,RLP25FEER400串联在输出回路中,通过采样电压(V=I×R)反馈至控制芯片,实现过流保护与输出调节。2W功率适配100W500W电源的10A50A电流检测。

2. 小型储能BMS过流保护

10kWh以下储能电池组需监测充放电电流,RLP25FEER400可准确采集10A~60A电流,配合BMS实现实时保护,宽温特性适应户外储能的温度变化。

3. 65W快充适配器电流控制

快充需精准匹配设备充电需求,RLP25FEER400的±1%精度保证采样误差≤0.4mV(1A电流下),满足PD3.0等快充协议的电流精度要求。

五、选型与使用注意事项

为确保性能稳定,需注意以下要点:

  1. 功率降额:实际功率不超过额定值的80%(1.6W),避免长期过热漂移;
  2. 布线优化:采样电阻靠近电流“热端”,布线长度≤5mm,减少寄生干扰;
  3. 温漂补偿:医疗等高精度场景可结合NTC温度传感器,软件修正阻值漂移;
  4. 存储运输:存储温度-40℃~85℃,湿度≤60%,开封后1个月内焊接,避免机械冲击。

总结而言,RLP25FEER400以“高功率密度+稳定精度+宽温适应性”为核心,精准匹配中等功率大电流采样场景,是工业、新能源、消费电子领域的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.