WMSIC Electronic Components

TA-I Technology RLP25FEER300

ModelRLP25FEER300
Package2512
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RLP25FEER300
Type
TA-I Technology
Minimum package
4000 圆盘

Technical parameters

Power
2W
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RLP25FEER300
Electronic Component
1
Package
2512
Electronic Component
Current Sense Resistor / Shunt
Electronic Component
±1%
Electronic Component
0.084g
Electronic Component
300mΩ
Electronic Component
1
Electronic Component
BM0264549150
Electronic Component
SMD
Electronic Component
±50ppm/℃
Resistor Type
Current Sense Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

大毅科技RLP25FEER300 贴片电流采样电阻产品概述

一、产品核心定位与应用场景

大毅科技RLP25FEER300是一款低阻值高精度贴片电流采样电阻,专为电路电流检测与反馈设计,属于分流器类元器件。其核心定位是在5A~80A中等电流范围内实现稳定、准确的采样,适配工业控制、新能源、消费电子等多领域需求。

典型应用场景包括:

  1. 新能源电池管理系统(BMS):电动车、储能电站的电池组充放电电流监测,防止过流、过充;
  2. 电源管理系统:开关电源、线性电源的输出电流限制与反馈调节,提升电源稳定性;
  3. 电机驱动系统:伺服电机、变频电机的电流采样,实现精确转矩控制与过载保护;
  4. 工业自动化:PLC、变频器的电流反馈回路,保障设备安全运行;
  5. 消费电子:大功率充电器、移动电源的电流检测,优化充电效率。

二、关键参数与性能指标

RLP25FEER300的参数围绕“低阻、高精度、稳定”设计,核心指标如下:

参数项 规格值 实际意义说明 类型 电流采样电阻 区别于普通电阻,专为电流检测优化,低阻值降低功耗与压降 阻值 300mΩ(0.3Ω) 低阻值适配大电流采样,如80A电流时压降仅24mV,在运放可检测范围内 精度 ±1% 初始阻值误差控制在±1%,满足工业级、消费电子的常规采样精度要求 额定功率 2W(25℃) 25℃环境下持续工作功率,温度升高需降额(如70℃时约1.5W) 温度系数(TCR) ±50ppm/℃ 温度每变化1℃,阻值变化±50×10⁻⁶,宽温范围(-40℃~125℃)下误差可控 安装方式 贴片(SMD) 无引脚设计,适配自动化贴装,减少寄生电感对高频采样的干扰 封装 2512 英制封装尺寸(6.4mm×3.2mm),体积小巧,适合高密度PCB设计

三、封装与工艺设计特点

RLP25FEER300采用2512贴片封装,结合大毅科技的合金箔工艺,具备以下优势:

  1. 合金箔电阻体:采用锰铜合金箔作为核心材料,相比金属膜电阻,温度系数更低、长期稳定性更强,阻值漂移极小;
  2. 低寄生电感:无引脚贴片设计,电阻体与PCB直接焊接,寄生电感<1nH,适合高频(<100kHz)电流采样场景;
  3. 散热优化:陶瓷基底导热性良好,配合PCB焊盘增加散热铜箔(如0.5mm²以上),可有效散发热量,避免功率过载;
  4. 抗环境干扰:阻燃环氧树脂包封,具备抗振动(10G~20G)、抗潮湿(湿度<95%)能力,适合恶劣工业环境。

四、应用优势与实际价值

  1. 宽温下高精度采样:±1%初始精度+±50ppm/℃ TCR,在-40℃~85℃(工业级典型温度)下,总阻值误差≤±1.3%,避免温度变化导致的电流测量偏差;
  2. 低损耗高效能:300mΩ低阻值使电流采样时的压降与功耗极小,如80A电流时功耗仅2W,对系统整体效率影响可忽略;
  3. 易集成与成本控制:2512封装适配常规SMT产线,无需特殊焊接工艺,节省PCB空间与生产时间,降低系统成本;
  4. 可靠耐用:大毅科技品控体系保障,产品符合RoHS、UL认证(典型特性),适合长期稳定工作场景。

五、注意事项与选型建议

  1. 功率降额:实际应用需根据环境温度降额,如70℃时功率限制在1.5W以内,避免过热损坏;
  2. PCB布线:采样电阻需靠近电流路径,焊盘增加散热铜箔,减少热阻;
  3. 电流范围匹配:适合5A~80A电流采样,若电流超过80A,需并联多只或选择更高功率型号;
  4. 精度升级:若需±0.5%更高精度,可选择同系列高精度型号(如RLP25FEER300F)。

总结:大毅科技RLP25FEER300是一款性价比突出的贴片电流采样电阻,兼顾低阻、高精度与可靠性,广泛适配新能源、工业控制等领域的中等电流采样需求,是系统电流检测的理想选择。

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