WMSIC Electronic Components

TA-I Technology RLP25FEGR040

ModelRLP25FEGR040
Package2512
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RLP25FEGR040
Type
TA-I Technology
Minimum package
4000 圆盘

Technical parameters

Power
3W
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RLP25FEGR040
Electronic Component
1
Package
2512
Electronic Component
Current Sense Resistor / Shunt
Electronic Component
±1%
Electronic Component
0.072g
Electronic Component
40mΩ
Electronic Component
1
Electronic Component
BM0264549153
Electronic Component
SMD
Electronic Component
±50ppm/℃
Resistor Type
Current Sense Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RLP25FEGR040 产品概述

一、产品简介

RLP25FEGR040 为大毅科技(Dayi Technology)出品的片式电流采样电阻(分流器),封装为常用的 2512 SMD 型,标称阻值 40 mΩ,额定功率 3W,阻值公差 ±1%,温度系数(TCR)±50 ppm/℃。该器件专为高精度电流检测与功率管理场景设计,兼顾低压降及良好的温度稳定性,适合在空间受限的表贴电路中直接实现电流取样。

二、主要特性

  • 阻值:40 mΩ(低阻值,减小电压损耗)
  • 功率:3W(2512 封装在良好散热条件下可承受较大连续电流)
  • 精度:±1%(初始精度高,便于直接测量或校准)
  • 温度系数:±50 ppm/℃(热漂小,长期测量稳定性好)
  • 安装方式:贴片(SMD,适合自动化装配)
  • 封装:2512(约 6.35 × 3.2 mm,适中尺寸利于散热)

三、典型电气与热性能

  • 最大连续电流(理论):I = sqrt(P/R) ≈ sqrt(3 / 0.04) ≈ 8.66 A(实际使用应按 PCB 散热条件和环境温度进行降额)
  • 例:5 A 时压降 V = I·R = 0.2 V,功耗 P = I^2·R = 1.0 W
  • 由于为功率耗散型元件,实际允许电流受 PCB 铜箔面积、过孔和周围元件影响,建议在使用中进行热仿真或通过测量确定长期稳定工作点。

四、应用场景

  • 电源管理:DC-DC、LDO 负载电流检测
  • 电池管理系统(BMS):充放电采样、SOC 估算
  • 电机驱动与逆变器:电流闭环检测与保护
  • 通信与服务器电源轨电流监控
  • USB/PD、快充保护与限流检测

五、PCB 布线与安装建议

  • 将采样电阻放置于电流路径上靠近负载或电源端口,尽量缩短与测量放大器之间的路径。
  • 为降低测量误差,尽可能采用四端测量(两个主流端承载电流,两个测量端连接差分放大器);若器件为两端结构,可在其两侧使用短、粗的测量走线并靠近放大器输入。
  • 增大两侧铜箔面积和过孔以增强散热,避免在高功率工况下出现过高结温。
  • 推荐遵循厂商回流焊工艺规范,避免机械应力影响电阻长期稳定性。

六、选型与注意事项

  • 若系统允许更大压降并追求更低发热,可选择更高阻值或更大功率等级的分流器。
  • 注意浪涌电流与脉冲功率能力,短时冲击可能超出连续额定功率,需参考厂家脉冲曲线或做热仿真。
  • 长期工作时注意阻值漂移与环境应力,必要时在系统中预留校准或自检机制。
  • 采购时确认包装方式(通常为卷带装)与批次一致性,便于量产和替换。

RLP25FEGR040 在精度、热漂与功率密度之间保持了良好平衡,适用于需要可靠电流采样且受空间限制的电源与电池管理设计中。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.