Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TA-I Technology RMH25FE2000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RMH25FE2000
- Type
- TA-I Technology
- Minimum package
- 4000 圆盘
Technical parameters
- Power
- 2W
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- RMH25FE2000
- Electronic Component
- 1
- Package
- 2512
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.146g
- Electronic Component
- 200Ω
- Electronic Component
- 1
- Electronic Component
- BM0265427469
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 200V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RMH25FE2000厚膜贴片电阻产品概述
一、产品定位与核心身份
RMH25FE2000是大毅科技推出的一款中功率厚膜贴片电阻，采用行业标准2512封装，专为表面贴装工艺设计，核心聚焦2W功率承载、200Ω阻值及±1%精度，是替代传统插件电阻、适配量产需求的标准化元件，广泛覆盖工业、汽车、通信等领域的中等功率电路场景。
二、关键电气性能参数
该电阻的电气参数明确适配实用场景，核心指标如下：
- 阻值与精度：标称阻值200Ω，精度±1%——满足多数电路对阻值偏差的基本要求，无需额外校准即可用于分压、限流等基础功能；
- 功率承载：连续工作功率2W——支撑中等功率负载（如电源模块10mA/20V级负载、电机驱动辅助限流）；
- 工作电压：额定工作电压200V——兼容常规直流/交流电路电压范围，避免过压击穿风险；
- 温度系数：±100ppm/℃——反映温度变化对阻值的影响（如100℃温差下阻值偏差±1%），适配一般环境温度波动场景。
三、封装与工艺特性
- 封装形式：2512贴片封装（英制尺寸，公制约6.4mm×3.2mm），兼容主流SMT生产线，支持自动化贴装、回流焊工艺，适合批量生产；
- 厚膜工艺：采用厚膜印刷工艺制备，相比薄膜电阻成本更低、功率密度更高，同时具备较好的耐过载能力，平衡了中功率应用的成本与性能需求。
四、环境适应性表现
RMH25FE2000的环境适应性满足多场景需求：
- 工作温度范围：-55℃~+155℃——覆盖工业控制、汽车电子等领域的高低温环境（如户外设备冬季低温、车载电路夏季高温）；
- 耐温稳定性：结合±100ppm/℃温度系数，宽温范围内阻值变化可控，无需额外温度补偿即可稳定工作；
- 抗振性能：厚膜层附着力强，抗机械振动、冲击能力优于部分薄膜电阻，适合振动环境（如工业设备、汽车行驶中的电路）。
五、典型应用场景
基于核心参数与特性，该电阻主要应用于：
- 工业控制：PLC信号分压、电机驱动辅助限流；
- 电源模块：开关电源反馈分压、线性电源负载电阻；
- 汽车电子：车载中控信号调理、车灯驱动限流（适配-40℃~+85℃车载环境）；
- 通信设备：基站射频辅助电阻、光模块功率匹配电阻。
六、品牌与可靠性背书
大毅科技作为专业被动元件厂商，RMH25FE2000遵循IEC 60115、JIS C 5201等行业标准，经过1000小时@125℃满功率负载测试、-55℃~+155℃循环1000次温度测试等可靠性验证，确保量产一致性与长期工作稳定性，适合商用/工业级产品的可靠性要求。
该产品以“成本可控+性能实用”为核心，是中等功率电路中替代传统插件电阻的高性价比选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
