WMSIC Electronic Components

TA-I Technology RLP25FEER001

ModelRLP25FEER001
Package2512
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RLP25FEER001
Type
TA-I Technology
Minimum package
4000 圆盘

Technical parameters

Power
2W
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RLP25FEER001
Electronic Component
1
Package
2512
Electronic Component
Current Sense Resistor / Shunt
Electronic Component
±1%
Electronic Component
0.084g
Electronic Component
1mΩ
Electronic Component
1
Electronic Component
BM0264975368
Electronic Component
SMD
Electronic Component
±50ppm/℃
Resistor Type
Current Sense Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RLP25FEER001 产品概述

一、产品简介

RLP25FEER001 是大毅科技推出的一款贴片式电流采样电阻(分流器),阻值 1mΩ,精度 ±1%,额定功率 2W,温度系数(TCR)±50ppm/℃,封装规格为 2512(约 6.35×3.18mm)。该器件用于将流过的电流转换为低压降电压信号,便于电流检测与控制系统进行采样和测量。

二、主要性能与参数

  • 阻值:1mΩ ±1%(高精度,适合精确电流测量)
  • 额定功率:2W(贴片散热,需注意 PCB 热设计)
  • 温度系数:±50ppm/℃(≈0.005%/℃,温度漂移小)
  • 封装:2512 贴片封装,适配常规 SMT 工艺
  • 安装方式:贴片(SMD),兼容回流焊工艺

三、应用场景

  • 开关电源与 DC-DC 转换器的电流检测与限流
  • 电池管理系统(BMS)、充放电监控
  • 电机驱动与负载电流监测
  • 逆变器、UPS 与充电桩的电流采样
  • 测试测量设备与保护电路

四、使用与 PCB 设计建议

  • 电压降与功率示例:I×R,例如 10A 时电压降 10mV,功耗 0.1W;理论最大连续电流 Imax = sqrt(P/R) ≈ 44.7A(在理想散热条件下)。为保证可靠性建议按 60%~75% 额定功率退载长期使用(建议连续电流控制在 27–33A 范围以内,具体取决于 PCB 散热)。
  • 热管理:在器件两侧设计大铜箔散热区并通过多盏过孔导热至内层/底层,提高散热能力,避免局部过热引起阻值漂移或失效。
  • 布线与测量:因电阻值极低,测量电压很小,建议在 PCB 布局上采用独立的取样回路或 Kelvin(四端)测量思想(将取样信号尽量靠近 ADC 或放大器输入),减小引线与焊盘电阻及接触电阻的影响。
  • 测量前端:选择低偏置电流、低偏置电压漂移的仪表放大器或运放,并考虑共模电压范围(高侧/低侧检测)。加入适当滤波以抑制开关噪声和冲击电流影响。
  • 焊接工艺:兼容标准回流焊,遵循厂商的回流温度曲线与 IPC 焊接建议,避免过热与机械应力。

五、可靠性与测试

  • 建议在量产前进行四线测量、温升测试与循环功率老化试验,评估长期漂移与热电势效应。
  • 考虑热冲击与焊接振动对贴片电阻的影响,做机械可靠性验证。
  • 对于高精度应用,建议在工作温度范围内进行温度漂移校准与补偿。

六、选型与注意事项

  • 若系统需更低压降或更高稳定性,可选更大功率或更低 TCR 的分流器;若需简单安装与更小外形,可考虑更小封装但注意额定功率限制。
  • 设计时应平衡电压信号大小、损耗与热管理,对关键测量点进行额外校准以保证系统精度。

RLP25FEER001 以其 1mΩ/±1% 的高精度及 2W 的额定功率,适用于多数中大电流检测场合,配合合理的 PCB 热设计与测量电路,可在电源管理与动力系统中提供稳定可靠的电流采样解决方案。

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