WMSIC Electronic Components

TA-I Technology RL10FTNR100

ModelRL10FTNR100
Package0805
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RL10FTNR100
Type
TA-I Technology
Minimum package
5000 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RL10FTNR100
Electronic Component
1
Package
0805
Electronic Component
Current Sense Resistor / Shunt
Electronic Component
±1%
Electronic Component
0.028g
Electronic Component
100mΩ
Electronic Component
1
Electronic Component
BM0264549231
Electronic Component
SMD
Electronic Component
±200ppm/℃
Resistor Type
Metal Film Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RL10FTNR100合金电阻产品概述

一、产品基本定位

RL10FTNR100是大毅科技推出的一款贴片式合金电阻,针对低阻值、高精度的电流检测与功率控制场景设计,采用0805标准贴片封装,兼顾小型化与性能稳定性,广泛适配消费电子、工业控制等领域的电路需求。

二、核心性能参数深度解析

这款电阻的核心参数围绕“低阻值+高精度+稳定温度特性”展开,具体如下:

  1. 阻值与精度:标称阻值100mΩ(即0.1Ω),精度±1%——实际阻值偏差控制在0.099Ω0.101Ω之间,能为电流采样提供精准的电压降参考(如1A电流通过时,压降为99mV101mV),避免因阻值误差导致的检测偏差。
  2. 功率承载能力:额定功率250mW(1/4W)——实际功耗需低于额定值,结合阻值计算,最大持续工作电流约1.58A(I=√(P/R)=√(0.25/0.1)),可满足多数中小功率电路的电流检测需求。
  3. 温度系数:±200ppm/℃——合金材质的低温度系数特性(相比碳膜电阻的数百ppm/℃更优),可适应-55℃~125℃的环境变化。例如温度从25℃升至85℃(温差60℃),阻值变化仅约1.2%,叠加原始精度后总误差仍控制在±2.2%以内,可靠性更高。

三、封装与安装特性

RL10FTNR100采用0805贴片封装(尺寸约2.0mm×1.2mm×0.5mm),具备以下优势:

  • 小型化适配:符合电子设备“轻薄化”趋势,可集成于手机、平板、小型电源模块等紧凑空间内;
  • 自动化兼容:支持回流焊、波峰焊等自动化生产工艺,适配SMT生产线,降低人工成本;
  • 抗干扰设计:贴片式结构减少引脚电感,适合高频电路应用,焊接点稳定性优于插件电阻,抗振动性能更好。

四、典型应用场景

结合参数特性,RL10FTNR100主要适用于以下场景:

  1. 电流采样电路:电源适配器、DC-DC变换器的输出电流检测,电池管理系统(BMS)的单体电池充放电电流监控——低阻值降低电路功耗,高精度保证检测准确性;
  2. 过流保护电路:小功率电机驱动、LED驱动电路的过流检测,当电流超过阈值时,电阻压降触发保护机制,避免器件损坏;
  3. 便携式电子设备:手机、智能手表的电源路径检测,耳机放大器的电流控制——0805封装适配小型化需求,稳定温度特性适应日常温度变化;
  4. 工业控制模块:小型PLC、传感器信号调理电路的电流基准参考,满足工业环境下的可靠性要求。

五、品牌与可靠性保障

大毅科技作为专业元器件制造商,对RL10FTNR100的生产过程严格把控:

  • 材质工艺:采用镍铬合金电阻体,焊接端镀锡,符合RoHS无铅环保标准;
  • 可靠性测试:经过高低温循环(-55℃125℃,1000次)、湿度测试(85℃/85%RH,1000小时)、振动测试(102000Hz,2g加速度),确保长期稳定;
  • 行业适配:参数符合IEC、JIS国际标准,可直接用于消费电子、工业控制等领域批量生产。

这款电阻以“精准、稳定、小型化”为核心优势,是中小功率电流检测场景的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.